Gas enclosure assembly and system and related printing maintenance methods
View Patent ↗The present teachings relate to various embodiments of an hermetically-sealed gas enclosure assembly and system that can be readily transportable and assemblable and provide for maintaining a minimum inert gas volume and maximal access to various devices and apparatuses enclosed therein. Various embodiments of an hermetically-sealed gas enclosure assembly and system of the present teachings can have a gas enclosure assembly constructed in a fashion that minimizes the internal volume of a gas enclosure assembly, and at the same time optimizes the working space to accommodate a variety of footprints of various OLED printing systems. Various embodiments of a gas enclosure assembly so constructed additionally provide ready access to the interior of a gas enclosure assembly from the exterior during processing and readily access to the interior for maintenance, while minimizing downtime.
1. A method for maintenance of an industrial printing system comprising:
controlling a processing environment in a gas enclosure within a defined specification that is different from an environment external the gas enclosure, the gas enclosure comprising:
a first enclosure section defining a first volume of the gas enclosure, wherein the first enclosure section is configured to house the industrial printing system; said industrial printing system comprising a printhead assembly having at least one printhead;
a second enclosure section defining a second volume of the gas enclosure, wherein the second enclosure section is configured to house at least one device used for performing one of a maintenance and a calibration procedure;
a first opening configured to be selectively opened and closed to selectively place the first enclosure section and the second enclosure section in flow communication with each other; and
a second opening configured to selectively provide access between the second enclosure section and the environment external the gas enclosure;
positioning the printhead assembly proximal to the first opening; and
performing one of a maintenance procedure and a calibration procedure on the at least one printhead while the first opening is open and the second opening is closed.
2. The method of claim 1 , further comprising after positioning the printhead assembly, sealing the first opening with the printhead assembly, wherein the sealing isolates the second enclosure section from the first enclosure section.
3. The method of claim 2 , further comprising accessing the second enclosure section from the environment external the gas enclosure by opening the second opening while maintaining isolation of the second enclosure section from the first enclosure section.
4. The method of claim 3 , further comprising loading at least one of a replacement printhead and a replacement printhead assembly into the second enclosure section.
5. The method of claim 4 , further comprising removing at least one of a malfunctioning printhead and a malfunctioning printhead assembly from the second enclosure section.
6. The method of claim 5 , further comprising:
isolating the second enclosure section from the environment external the gas enclosure by closing the second opening while maintaining isolation of the second enclosure section from the first enclosure section; and
controlling the processing environment in the second enclosure section within the defined specification.
7. The method of claim 1 , wherein the second volume of the second enclosure section is about 1% to about 10% of the total volume of the gas enclosure.
8. The method of claim 1 , wherein the second volume of the second enclosure section is about 2% to about 5% of the total volume of the gas enclosure.
9. The method of claim 1 , wherein controlling the processing environment comprises controlling levels of reactive species to prevent contamination, oxidation and damage of materials and substrates processed in the industrial printing system.
10. The method of claim 9 , wherein the reactive species are controlled at levels of about 100 ppm or less.
11. The method of claim 9 , wherein the reactive species are controlled at levels of about 1 ppm or less.
12. The method of claim 1 , wherein controlling the processing environment comprises providing an inert gas processing environment within the gas enclosure.
13. The method of claim 12 , wherein the inert gas processing environment is provided by using gases selected from nitrogen, any of the noble gases, and combinations thereof.
14. The method of claim 1 , wherein controlling the processing environment comprises providing a low-particle processing environment in the gas enclosure.
15. The method of claim 1 , wherein the industrial printing system is configured to perform a printing procedure on a substrate having a size of about generation 3.5 to about generation 10.
16. A method for maintaining the process environment of an industrial printing system comprising:
controlling a processing environment in a gas enclosure within a defined specification that is different from an environment external the gas enclosure, the gas enclosure comprising:
a first enclosure section defining a first volume of the gas enclosure, wherein the first enclosure section is configured to house the industrial printing system; said industrial printing system comprising a printhead assembly having at least one printhead;
a second enclosure section defining a second volume of the gas enclosure, wherein the second enclosure section is configured to house at least one device used for performing one of a maintenance and a calibration procedure;
a first opening configured to be selectively opened and closed to selectively place the first enclosure section and the second enclosure section in flow communication with each other; and
a second opening configured to selectively provide access between the second enclosure section and the environment external the gas enclosure;
accessing the second enclosure section from the environment external the gas enclosure by opening the second opening while the first opening is closed;
transferring the at least one device used for performing one of a maintenance and a calibration procedure into the second enclosure section while the second opening is open and the first opening is closed; and
closing the second opening while the first opening is closed, wherein upon the closure of the second opening the second volume is recovered within the specification defined for the processing environment.
17. The method of claim 16 , wherein transferring the at least one device comprises transferring at least one of a replacement printhead and a replacement printhead assembly into the second enclosure section.
18. The method of claim 16 , further comprising after transferring the at least one device, removing at least one of a malfunctioning printhead and a malfunctioning printhead assembly from the second enclosure section.
19. The method of claim 16 , wherein the second volume of the second enclosure section is about 1% to about 10% of the total volume of the gas enclosure.
20. The method of claim 16 , wherein controlling the processing environment comprises controlling levels of reactive species to prevent contamination, oxidation and damage of materials and substrates processed in the industrial printing system.
21. The method of claim 20 , wherein the reactive species are controlled at levels of about 100 ppm or less.
22. The method of claim 16 , wherein controlling the processing environment comprises providing an inert gas processing environment within the gas enclosure.
23. The method of claim 16 , wherein the inert gas processing environment is provided by using gases selected from nitrogen, any of the noble gases, and combinations thereof.
24. The method of claim 16 , wherein controlling the processing environment comprises providing a low-particle processing environment in the gas enclosure.
25. The method of claim 16 , wherein the industrial printing system is configured to perform a printing procedure on a substrate having a size of about generation 3.5 to about generation 10.