Active matrix display panel with ground tie lines
A display panel and a method of forming a display panel are described. The display panel may include a thin film transistor substrate including a pixel area and a non-pixel area. The pixel area includes an array of bank openings and an array of bottom electrodes within the array of bank openings. A ground line is located in the non-pixel area and an array of ground tie lines run between the bank openings in the pixel area and are electrically connected to the ground line in the non-pixel area.
1. A display panel comprising:
a ground line;
a display substrate including a pixel area and a non-pixel area;
an array of micro LED devices on the display substrate within the pixel area;
an array of bottom contacts formed on a planarization layer and underneath the array of micro LED devices;
an array of ground tie lines located below the planarization layer and running between the micro LED devices in the pixel area and electrically connected to the ground line; and
one or more top electrode layers over and in electrical contact with the array of micro LED devices and the array of ground tie lines.
2. The display panel of claim 1 , wherein the micro LED devices are vertical micro LED devices.
3. The display panel of claim 2 , wherein each vertical micro LED device comprises an inorganic semiconductor-based p-n diode.
4. The display panel of claim 3 , wherein the micro LED devices each have a maximum width of 1 μm-100 μm.
5. The display panel of claim 3 , further comprising a transparent passivation layer spanning sidewalls of the array of vertical micro LED devices, wherein the transparent passivation layer does not completely cover a top conductive contact of each vertical micro LED device.
6. The display substrate of claim 1 , further comprising a bank layer on the planarization layer, the bank layer comprising an array of bank openings, wherein the array of micro LED devices are within the array of bank openings.
7. The display substrate of claim 1 , further comprising an array of via openings in the planarization layer exposing the array of ground tie lines.
8. The display substrate of claim 7 , further comprising an array of conductive via opening layers within the array of via openings and on the array of ground tie lines.
9. The display panel of claim 8 , wherein the one or more top electrode layers comprises a single top electrode layer over and in electrical contact with the array of micro LED devices and the array of conductive via opening layers.
10. The display panel of claim 8 , wherein the one or more top electrode layers comprises an array of electrode layers over and in electrical contact with the array of micro LED devices and the array of conductive via opening layers.
11. The display panel of claim 3 , wherein the one or more top electrode layers comprises a single top electrode layer over and in electrical contact with the array of micro LED devices and the array of ground tie lines.
12. The display panel of claim 11 , wherein the single top electrode layer is formed of a transparent or semi-transparent material.
13. The display panel of claim 11 , wherein the single top electrode layer comprises a material selected from the group consisting of PEDOT and ITO.
14. The display panel of claim 3 , wherein the one or more top electrode layers comprises an array of electrode layers over and in electrical contact with the array of micro LED devices and the array of ground tie lines.
15. The display panel of claim 14 , wherein each top electrode layer electrically connects a plurality of micro LED devices to a single ground tie line.
16. The display panel of claim 14 , wherein the array of top electrode layers is formed of a transparent or semi-transparent material.
17. The display panel of claim 14 , wherein the array of top electrode layers comprises a material selected from the group consisting of PEDOT and ITO.