IP Library Granted Patent US 9,502,616
Granted Patent B2
US 9,502,616 · App. 14/641,565 · Granted Nov 22, 2016

Light-emitting diode

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,502,616
App. No.
14/641,565
Granted
Nov 22, 2016
Kind
B2
Abstract

The present invention relates to a light-emitting diode (LED), which comprises electrodes having a single metal reflective layer. The single metal reflective layer is thicker than the active layer of the LED. Thereby, at least a portion of light emitted from the active layer is reflected by the single metal reflective layer, and thus enhancing the light-emitting efficiency of the LED.

Claims (21)

1. A light-emitting diode, comprising:

a stacked semiconductor layer structure, comprising a first-type semiconductor layer, an active layer, and a second-type semiconductor layer, and said active layer disposed between said first-type semiconductor layer and said second-type semiconductor layer; and

a first electrode and a second electrode, disposed on the same side of said stacked semiconductor layer structure, said first electrode disposed on said first-type semiconductor layer, and said second electrode disposed on said second-type semiconductor layer;

wherein said first electrode comprises a single metal reflective layer and a pad layer; said pad layer is disposed on said single metal reflective layer; the thickness of said single metal reflective layer is greater than the thickness of said active layer; the height of the bottom of said single metal reflective layer is lower than the height of the bottom of said active layer; the height of the top of said single metal reflective layer is higher than the height of the top of said active layer; the area of the metal reflective layer is the same as the area of the pad layer; and at least a portion of light emitted from said active layer is reflected by said single metal reflective layer.

2. The light-emitting diode of claim 1 , further comprising a transparent conductive layer disposed between said second-type semiconductor layer and said second electrode.

3. The light-emitting diode of claim 2 , wherein the height of the top of said single metal reflective layer is not lower than the height of said transparent conductive layer.

4. The light-emitting diode of claim 3 , wherein a gap with a width ranged between 7-8 um is formed between said first electrode and said active layer.

5. The light-emitting diode of claim 3 , wherein the material of said single metal reflective layer includes aluminum or aluminum alloy.

6. The light-emitting diode of claim 5 , wherein the material of said pad layer includes gold.

7. The light-emitting diode of claim 3 , wherein the material of said single metal reflective layer includes one selected from the group consisting of aluminum, platinum, titanium, tantalum, ruthenium, rhodium, silver, nickel, and lead.

8. The light-emitting diode of claim 3 , wherein the thickness of said single metal reflective layer is not less than 1 um.

9. The light-emitting diode of claim 3 , wherein the material of said pad layer includes gold.

10. The light-emitting diode of claim 3 , wherein the thickness of said pad layer is not less than 0.8 um.

11. The light-emitting diode of claim 1 , wherein a gap with a width ranged between 7-8 um is formed between said first electrode and said active layer.

12. The light-emitting diode of claim 1 , wherein the material of said single metal reflective layer includes aluminum or aluminum alloy.

13. The light-emitting diode of claim 12 , wherein the material of said pad layer includes gold.

14. The light-emitting diode of claim 1 , wherein the material of said single metal reflective layer includes one selected from the group consisting of aluminum, platinum, titanium, tantalum, ruthenium, rhodium, silver, nickel, and lead.

15. The light-emitting diode of claim 1 , wherein the thickness of said single metal reflective layer is not less than 1 um.

16. The light-emitting diode of claim 1 , wherein the material of said pad layer includes gold.

17. The light-emitting diode of claim 1 , wherein the thickness of said pad layer is not less than 0.8 um.

18. The light-emitting diode of claim 1 , further comprising a reflective layer and a substrate, wherein the substrate is interposed between the reflective layer and the stacked semiconductor layer structure.

Assignments (3)
CHANGE OF NAME Recorded Feb 18, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075171/0402 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 26, 2016
From: FORMOSA EPITAXY INCORPORATION
To: EPISTAR CORPORATION
Reel/Frame 039859/0548 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 9, 2015
From: CHEN, YU-YUN; LIN, YUNG-HSIN; LI, FANG-I; PAN, SHYI-MING
To: FORMOSA EPITAXY INCORPORATION
Reel/Frame 035113/0412 →