Semiconductor device and method of manufacturing the same
View Patent ↗In one embodiment, a semiconductor device includes a substrate, and first to fourth interconnects provided on the substrate to be adjacent to one another. The device includes a first pad portion connected with the first or second interconnect, and a second pad portion adjacent to the first pad portion in a first direction. The device includes a third pad portion connected with the third or fourth interconnect, and adjacent to one of the first and second pad portions in a second direction, and a fourth pad portion adjacent to the third pad portion in the first direction, and adjacent to the other of the first and second pad portions in the second direction. The device includes one or more interconnects insulated from the first to fourth interconnects and the first to fourth pad portions, and provided between the first and second interconnects and the third and fourth interconnects.
1. A semiconductor device comprising:
a substrate;
first to fourth interconnects provided on the substrate so as to be adjacent to one another;
a first pad portion connected with the first or second interconnect;
a second pad portion adjacent to the first pad portion in a first direction and in a second direction perpendicular to the first direction;
a third pad portion connected with the third or fourth interconnect, and adjacent to one of the first and second pad portions in the second direction;
a fourth pad portion adjacent to the third pad portion in the first direction and in the second direction, and adjacent to the other of the first and second pad portions in the second direction; and
one or more interconnects electrically insulated from the first to fourth interconnects and the first to fourth pad portions, and provided between the first and second interconnects and the third and fourth interconnects,
wherein
a width of the first pad portion in the second direction is larger than a width of the second pad portion in the second direction,
a width of the fourth pad portion in the second direction is larger than a width of the third pad portion in the second direction,
a distance between an end portion of the first interconnect and an end portion of the second interconnect in the first direction, and a distance between the end portion of the first interconnect and the end portion of the second interconnect in the second direction are greater than a space width between the first interconnect and the second interconnect, and
a distance between an end portion of the third interconnect and an end portion of the fourth interconnect in the first direction, and a distance between the end portion of the third interconnect and the end portion of the fourth interconnect in the second direction are greater than a space width between the third interconnect and the fourth interconnect.
2. The device of claim 1 , wherein the one or more interconnects include an interconnect having a ring shape.
3. The device of claim 1 , wherein
the first and second pad portions are respectively connected with the first and second interconnects, and
the third and fourth pad portions are respectively connected with the third and fourth interconnects.
4. The device of claim 1 , wherein
the first pad portion is located on a first side of the first direction in regard to the second pad portion,
the fourth pad portion is located on the first side of the first direction in regard to the third pad portion, and
end portions of the first to fourth interconnects are located on a second side of the first direction in regard to the first to fourth pad portions, respectively.
5. The device of claim 1 , wherein
the first pad portion is located on a first side of the first direction in regard to the second pad portion, the fourth pad portion is located on the first side of the first direction in regard to the third pad portion, and the one or more interconnects are located on a second side of the first direction in regard to the second and third pad portions.
6. The device of claim 1 , further comprising first to fourth contact plugs provided on the first to fourth pad portions, respectively.
7. The device of claim 1 , wherein
the first and second pad portions are divided by a first trench that extends in the first and second directions between the first and second pad portions, and
the third and fourth pad portions are divided by a second trench that extends in the first and second directions between the first and second pad portions.
8. The device of claim 1 , wherein
each of the first to fourth interconnects comprises a plurality of straight line portions and a plurality of bent portions, each of which is provided between two of the straight line portions,
the longest straight line portion in the first interconnect, the longest straight line portion in the second interconnect, the longest straight line portion in the third interconnect, and the longest straight line portion in the fourth interconnect extend in the second direction, and
the lengths of sections of the first to fourth interconnects are different as they extend in the two directions.
9. The device of claim 1 , wherein
the first pad portion is located on a first side of the first direction in regard to the second pad portion,
the fourth pad portion is located on the first side of the first direction in regard to the third pad portion, and
the one or more interconnects are located on a second side of the first direction in regard to the first to fourth pad portions.