Thermosetting resin composition, method for producing same, method for producing cured resin product, and method for causing self-polymerization of epoxy compound
View Patent ↗The present invention is directed to provide at least one of a novel thermosetting resin composition using an epoxy compound, a method for producing the composition, a method for producing a novel cured resin using an epoxy compound, and a novel method for causing self-polymerization of an epoxy compound. The thermosetting resin composition includes an epoxy compound, a gallium compound, and a silanol source compound. The method for producing the thermosetting resin composition includes a step of mixing the epoxy compound with the gallium compound and the silanol source compound. The method for producing a cured resin includes a step of heating an epoxy compound in the presence of a gallium compound and silanol. The method for causing self-polymerization of an epoxy compound is characterized by using a gallium compound and silanol as catalysts.
1. A thermosetting resin composition comprising an epoxy compound, a gallium compound, and a silanol source compound, wherein
said gallium compound. is gallium triacetylacetylacetonate or gallium acetate, and
said silanol source compound comprises a monosilane compound and/or an organopolysiloxane of formula(19):
(R 21 3 SiO 1/2 ) a2 (R 22 2 SiO 2/2 ) b2 (R 23 SiO 3/2 ) c2 (SiO 4/2 ) d2 (O 1/2 H) e2 (19)
where
R 21 , R 22 , and R 23 each independently represent a C 1-10 hydrocarbon group,
a2, b2, c2, and d2are each an integer of 0 or more and satisfy the condition of a2+b2+c2+d2≧3, and
e2is a natural number of 1 or more and represents the number of a hydroxy group (s) directly bonded to a silicon atom.
2. The thermosetting resin composition according to claim 1 , wherein the epoxy compound is a cycloaliphatic epoxy compound.
3. The thermosetting resin composition according to claim 1 , wherein the silanol source compound is an organopolysiloxane of Formula (19).
4. The thermosetting resin composition according to claim 1 , wherein the silanol source compound is a monosilane compound.
5. The thermosetting resin composition according to claim 1 , wherein the gallium compound is a gallium complex that has a chelating ligand.
6. A method for producing a cured resin, the method comprising a step of heating an epoxy compound in the presence of a gallium compound and a silanol source compound, wherein
said gallium compound is gallium triacetylacetonate or gallium acetate, and
said silanol source compound comprises a monosilane compound and/or an organopolysiloxane of Formula (19 1 ):
(R 21 3 SiO 1/2 ) a2 (R 22 2 SiO 2/2 ) b2 (R 23 SiO 3/2 ) c2 (SiO 4/2 ) d2 (O 1/2 H) e2 (19)
Where
R 21 , R 22 , and R 23 each independently represent a C 1-10 hydrocarbon group, a2, b2, c2, and d2are each an integer of 0 or more and satisfy the condition of a2+b2+c2+d2≧3, and
e2 is a natural number of 1 or more and represents the number of hydroxyl group(s) directly bonded to a silicon atom.
7. The method according to claim 6 , wherein the epoxy compound is a cycloaliphatic epoxy compound.
8. The method according to claim 6 , wherein an organopolysiloxane of Formula (19) is used as a source of the silanol.
9. The method according to claim 6 , wherein a monosilane compound is used as a source of the silanol.
10. The method according to claim 6 , wherein a gallium complex that has a chelating ligand is used as the gallium compound.
11. A method for causing self-polymerization of an epoxy compound, the method comprising a step of adding a gallium compound and a silanol source compound as catalysts, wherein
said gallium compound is gallium triacetylacetonate or gallium acetate, and
said silanol source compound comprises a monosilane compound and/or an organopolysiloxane of Formula (19):
(R 21 3 SiO 1/2 ) a2 (R 22 2 SiO 2/2 ) b2 (R 23 SiO 3/2 ) c2 (SiO 4/2 ) d2 (O 1/2 H) e2 (19)
where
R 21 , R 22 , and R 23 each independently represent a C 1-10 hydrocarbon group, a2, b2, c2, and d2 are each an integer of 0 or more and satisfy the condition of a2+b2+c2+d2≧3, and
e2 is a natural number of 1 or more and represents the number of hydroxyl group(s) directly bonded to a silicon atom.
12. The method according to claim 11 , wherein the epoxy compound is a cycloaliphatic epoxy compound.
13. The method according to claim 11 , wherein an organopolysiloxane of Formula (19) is used as a source of the silanol.
14. The method according to claim 11 , wherein a monosilane compound is used as a source of the silanol.
15. The method according to claim 11 , wherein the gallium compound is a gallium complex that has a chelating ligand.