Multilayer printed board and layout method for multilayer printed board
View Patent ↗According to one embodiment, a multilayer printed board includes an insulating substrate, a differential signal wiring, and anti-pad regions. Distances between peripheries of the pad and a constant potential layer in each of the wiring layers are set so that a capacitance between the constant potential layers and a signal via included in a signal line constituting the differential signal wiring, which has a longer route from a transmission end to a reception end, is smaller than a capacitance between the constant potential layers and another signal via included in the other signal line.
1. A multilayer printed board comprising:
an insulating substrate made of an insulating material and provided with two or more wiring layers that include a constant potential layer and are disposed thereon in a thickness direction;
a differential signal wiring composed of two signal lines arranged in parallel with each other, each of the two signal lines including wiring portions arranged at the different wiring layers, a signal via, and pads, the wiring portion being arranged in a region where the constant potential layer is not arranged in each of the wiring layers, the signal via being connecting between the wiring portions of the different wiring layers, and the pads being respectively arranged at connection positions between the wiring portions and the signal via, within the wiring layers; and
anti-pad regions respectively formed between the constant potential layer and the pads that are located at a same height as the constant potential layer in the thickness direction in each of the wiring layers,
wherein distances in a direction perpendicular to the thickness direction between peripheries of the pad and the constant potential layer in each of the wiring layers are set so that a capacitance between the constant potential layers and a signal via included in one of the signal lines constituting the differential signal wiring, which has a longer route from a transmission end to a reception end, is smaller than a capacitance between the constant potential layers and another signal via included in the other one of the signal lines.
2. The multilayer printed board according to claim 1 , wherein the pads have circular shapes,
the anti-pad regions have annular shapes respectively around the pads, and
radii respectively connecting peripheries of the anti-pad regions to centers of the pads are set such that one of the radii for the signal line having a longer route is larger than another one of the radii for the other signal line.
3. The multilayer printed board according to claim 1 , wherein the pads have polygonal shapes,
the anti-pad regions have polygonal ring shapes respectively around the pads, and
shortest distances respectively connecting peripheries of the anti-pad regions to peripheries of the pads are set such that one of the shortest distances for the signal line having a longer route is larger than another one of the shortest distances for the other signal line.
4. The multilayer printed board according to claim 1 , wherein the pads have polygonal shapes,
the anti-pad regions have polygonal ring shapes respectively around the pads, and
distances respectively defined between circumscribed circles of the anti-pad regions and circumscribed circles of the pads are set such that one of the distances for the signal line having a longer route is larger than another one of the distances for the other signal line.
5. The multilayer printed board according to claim 1 , wherein the constant potential layer is a power supply layer or a GND layer.
6. The multilayer printed board according to claim 1 , wherein the insulating material constituting the insulating substrate is a glass epoxy resin, fluorine contained resin, or polyimide resin, and
the anti-pad regions are filled with a glass epoxy resin, fluorine contained resin, or polyimide resin.
7. The multilayer printed board according to claim 1 , wherein the pads for the two signal lines have sizes equal to each other.
8. A multilayer printed board comprising:
an insulating substrate made of an insulating material and provided with two or more wiring layers that include a constant potential layer and are disposed thereon in a thickness direction;
a bus wiring composed of a plurality of signal lines arranged in parallel with each other, each of the plurality of signal lines including wiring portions arranged at the different wiring layers, a signal via, and pads, the wiring portion being arranged in a region where the constant potential layer is not arranged in each of the wiring layers, the signal via being connecting between the wiring portions of the different wiring layers, and the pads being respectively arranged at connection positions between the wiring portions and the signal via, within the wiring layers; and
anti-pad regions respectively formed between the constant potential layer and the pads that are located at a same height as the constant potential layer in the thickness direction in each of the wiring layers,
wherein distances in a direction perpendicular to the thickness direction between peripheries of the pad and the constant potential layer in each of the wiring layers are set so that a capacitance between the constant potential layers and a signal via included in one of the signal lines constituting the bus wiring, which has a longer route from a transmission end to a reception end, is smaller than a capacitance between the constant potential layers and another signal via included in one of the signal lines, which has a shorter route.
9. The multilayer printed board according to claim 8 , wherein the pads have circular shapes,
the anti-pad regions have annular shapes respectively around the pads, and
radii respectively connecting peripheries of the anti-pad regions to centers of the pads are set such that one of the radii for the signal line having a longer route is larger than another one of the radii for the signal line having a shorter route.
10. The multilayer printed board according to claim 9 , wherein the radii respectively connecting peripheries of the anti-pad regions to centers of the pads are different from each other between all of the plurality of signal lines.
11. The multilayer printed board according to claim 9 , wherein the radii respectively connecting peripheries of the anti-pad regions to centers of the pads are equal to each other between some of the plurality of signal lines.
12. The multilayer printed board according to claim 8 , wherein the pads have polygonal shapes,
the anti-pad regions have polygonal ring shapes respectively around the pads, and
shortest distances respectively connecting peripheries of the anti-pad regions to peripheries of the pads are set such that one of the shortest distances for the signal line having a longer route is larger than another one of the shortest distances for the signal line having a shorter route.
13. The multilayer printed board according to claim 8 , wherein the pads have polygonal shapes,
the anti-pad regions have polygonal ring shapes respectively around the pads, and
distances respectively defined between circumscribed circles of the anti-pad regions and circumscribed circles of the pads are set such that one of the distances for the signal line having a longer route is larger than another one of the distances for the signal line having a shorter route.
14. The multilayer printed board according to claim 8 , wherein the constant potential layer is a power supply layer or a GND layer.
15. The multilayer printed board according to claim 8 , wherein the insulating material forming the insulating substrate is a glass epoxy resin, fluorine contained resin, or polyimide resin, and
the anti-pad regions are filled with a glass epoxy resin, fluorine contained resin, or polyimide resin.
16. The multilayer printed board according to claim 8 , wherein the pads for the plurality of signal lines have sizes equal to each other.