EVAPORATOR, DEPOSITION ARRANGEMENT, DEPOSITION APPARATUS AND METHODS OF OPERATION THEREOF
A depositing arrangement for evaporation of a material including an alkali metal or alkaline earth metal, and for deposition of the material on a substrate ( 4 ) is described. The arrangement a first chamber ( 110 ) configured for liquefying the material, a valve ( 130 ) being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve, an evaporation zone ( 114 ) being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material, and one or more outlets ( 116 ) for directing the vaporized material towards the substrate.
1 . A depositing arrangement for evaporation of a material comprising an alkali metal or alkaline earth metal and for deposition of the material on a substrate, comprising:
a first chamber configured for liquefying the material;
a valve being in fluid communication with the first chamber, and being downstream of the first chamber, wherein the valve is configured for control of the flow rate of the liquefied material through the valve;
an evaporation zone being in fluid communication with the valve, and being downstream of the valve, wherein the evaporation zone is configured for vaporizing the liquefied material; and
one or more outlets for directing the vaporized material towards the substrate.
2 . The arrangement according to claim 1 , further comprising:
a vapor distribution showerhead comprising the one or more outlets.
3 . The arrangement according to claim 1 , wherein the evaporation zone is provided by a chamber or surface with a surface contact area of 1 cm 2 to 10 cm 2 .
4 . The arrangement according to claim 1 , further comprising:
a controller connected to the valve, wherein the controller is configured to control the valve for adjusting the deposition rate of the vapor on the substrate.
5 . The arrangement according to claim 4 , wherein the controller is a proportional-integral-derivative controller, and wherein the controller comprises a signal input configured for receiving a signal of a deposition rate monitor system.
6 . The arrangement according to claim 1 , wherein the first chamber comprises a gas inlet configured for inlet of a protective gas in the first chamber, the arrangement further comprises a further valve configured for controlling the flow rate of the protective gas in the first chamber.
7 . The arrangement according to claim 6 , wherein the first chamber further comprises a pressure gauge in communication with the further valve.
8 . The arrangement according to claim 1 , wherein the material is metallic lithium.
9 . The arrangement according to claim 1 , further comprising:
an enclosure for housing at least the first chamber and the valve, wherein the enclosure is configured for exchange of the first chamber under protective atmosphere.
10 . A deposition apparatus for evaporation of a material comprising an alkali metal or alkaline earth metal and for deposition of the material on a substrate, the apparatus comprising:
a vacuum chamber for depositing the material on the substrate; and
an arrangement according to claim 1 .
11 . A method of evaporating a material comprising an alkali metal or alkaline earth metal, comprising:
liquefying the material in a first chamber;
guiding the liquefied material from the first chamber through a control valve to a evaporation zone;
evaporating the material in the evaporation zone; and
directing the vapor of the material on a substrate.
12 . The method according to claim 11 , wherein the material comprises metallic lithium.
13 . The method according to claim 11 , wherein the material is flash evaporated in the evaporation zone.
14 . The method according to claim 11 , wherein the liquefied material is maintained at a temperature of 185° C. to 285° C. before being evaporated.
15 . The method according to claim 11 , further comprising:
a closed loop control for control of the valve for adjusting the flow rate of the liquefied material through the valve.
16 . The arrangement according to claim 2 , wherein the vapor distribution showerhead is a linear vapor distribution showerhead.
17 . The arrangement according to claim 2 , wherein the evaporation zone is provided by a chamber or surface with a surface contact area of 1 cm 2 to 10 cm 2 .
18 . The method according to claim 11 , further comprising:
controlling the control valve for adjusting the deposition rate of the vapor on the substrate.
19 . The method according to claim 23 , wherein the material comprises metallic lithium.
20 . The method according to claim 13 , wherein the material is flash evaporated at temperatures of 600° C. or above.