IP Library Granted Patent US 9,531,388
Granted Patent B2
US 9,531,388 · App. 14/651,696 · Granted Dec 27, 2016

Semiconductor device and method for controlling the same

Inventors: Takahiko Gomi (Tokyo, JP); Tetsuya Suzuki (Tokyo, JP)
Assignee: Renesas Electronics Corporation
H03L1/027G06F1/206G06F1/324Y02B60/1217
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Quick Facts
Patent No.
US 9,531,388
App. No.
14/651,696
Granted
Dec 27, 2016
Kind
B2
Abstract

A semiconductor device includes an operation unit (CPU) provided in a semiconductor chip and a temperature sensor (TS) that measures a temperature of the semiconductor chip. The semiconductor device compares a measured temperature (Ta) measured by the temperature sensor (TS) with a predetermined reference temperature (Tref). When the measured temperature (Ta) is higher than the reference temperature (Tref), the semiconductor device switches a frequency of an operation clock to be supplied to the operation unit (CPU) from a first frequency to a second frequency higher than the first frequency.

Claims (43)

1. A semiconductor device comprising:

an operation unit provided in a semiconductor chip;

a temperature sensor that measures a temperature of the semiconductor chip;

a controller that compares the measured temperature measured by the temperature sensor with a predetermined reference temperature to output a control signal based on the comparison result; and

a clock generation unit that generates an operation clock to be supplied to the operation unit based on the control signal,

wherein the controller is configured to control, when the measured temperature is higher than the reference temperature, the clock generation unit to switch a frequency of the operation clock from a first frequency to a second frequency higher than the first frequency, and

the operation unit outputs a first request, a second request, and an initializing signal, the controller calculating the reference temperature according to the first request, the controller acquiring the measured temperature according to the second request, and the controller being initialized according to the initializing signal.

2. The semiconductor device according to claim 1 , wherein the controller is configured to control, when the measured temperature is lower than the reference temperature, the clock generation unit to switch the frequency of the operation clock from the second frequency to the first frequency.

3. The semiconductor device according to claim 1 , wherein the controller comprises a reference temperature calculation unit that calculates the reference temperature.

4. The semiconductor device according to claim 3 , wherein the reference temperature calculation unit calculates the reference temperature based on a ratio of a predetermined idle current to a leakage current.

5. The semiconductor device according to claim 3 , wherein the reference temperature calculation unit updates the reference temperature according to a change in the number of cycles of the operation clock when the operation unit is in an active state.

6. The semiconductor device according to claim 1 , wherein a rate of a shutdown state in which a supply of a power supply voltage to the operation unit is stopped in a first mode in which the frequency of the operation clock is the first frequency is smaller than that in a second mode in which the frequency of the operation clock is the second frequency.

7. The semiconductor device according to claim 6 , further comprising a power supply controller that controls the supply of the power supply voltage to the operation unit.

8. A semiconductor device comprising:

an operation unit provided in a semiconductor chip;

a temperature sensor that measures a temperature of the semiconductor chip;

a controller that compares the measured temperature measured by the temperature sensor with a predetermined first reference temperature and a second reference temperature higher than the first reference temperature to output a control signal based on the comparison result, the first reference temperature and the second reference temperature being determined based on a predetermined reference temperature; and

a clock generation unit that generates an operation clock to be supplied to the operation unit based on the control signal,

wherein the controller controls, when the measured temperature is higher than the second reference temperature, the clock generation unit to switch a frequency of the operation clock from a first frequency to a second frequency higher than the first frequency, and

the operation unit outputs a first request, a second request, and an initializing signal, the controller calculating the reference temperature according to the first request, the controller acquiring the measured temperature according to the second request, and the controller being initialized according to the initializing signal.

9. The semiconductor device according to claim 8 , wherein the controller controls, when the measured temperature is lower than the first reference temperature, the clock generation unit to switch the frequency of the operation clock from the second frequency to the first frequency.

10. The semiconductor device according to claim 8 , wherein the controller controls, when the measured temperature is higher than the first reference temperature and lower than the second reference temperature, the clock generation unit so that the frequency of the operation clock is not changed.

11. The semiconductor device according to claim 8 , wherein the controller comprises a reference temperature calculation unit that calculates the first reference temperature and the second reference temperature.

12. The semiconductor device according to claim 11 , wherein the reference temperature calculation unit calculates the first reference temperature and the second reference temperature based on a ratio of a predetermined idle current to a leakage current.

13. The semiconductor device according to claim 11 , wherein the reference temperature calculation unit updates the first reference temperature and the second reference temperature according to a change in the number of cycles of the operation clock when the operation unit is in an active state.

14. The semiconductor device according to claim 8 , wherein a rate of a shutdown state in which a supply of a power supply voltage to the operation unit is stopped in a first mode in which the frequency of the operation clock is the first frequency is smaller than that in a second mode in which the frequency of the operation clock is the second frequency.

15. The semiconductor device according to claim 14 , further comprising a power supply controller that controls the supply of the power supply voltage to the operation unit.

16. A method for controlling a semiconductor device comprising:

measuring a temperature of a semiconductor chip;

comparing, by a controller, the measured temperature with a predetermined reference temperature;

switching, when the measured temperature is higher than the reference temperature, a frequency of an operation clock to be supplied to an operation unit formed in the semiconductor chip from a first frequency to a second frequency higher than the first frequency,

wherein the operation unit outputs a first request, a second request, and an initializing signal, the controller calculating the reference temperature according to the first request, the controller acquiring the measured temperature according to the second request, and the controller being initialized according to the initializing signal.

17. The method for controlling the semiconductor device according to claim 16 , further comprising a process of switching, when the measured temperature is lower than the reference temperature, the frequency of the operation clock from the second frequency to the first frequency.

18. The method for controlling the semiconductor device according to claim 16 , further comprising:

outputting a control signal based on the comparison result; and

generating the operation clock to be supplied to the operation unit based on the control signal.

19. A method for controlling a semiconductor device comprising:

measuring a temperature of a semiconductor chip;

comparing, by a controller, the measured temperature with a predetermined first reference temperature and a second reference temperature higher than the first reference temperature; and, the first reference temperature and the second reference temperature being determined based on a predetermined reference temperature

switching, when the measured temperature is higher than the second reference temperature, a frequency of an operation clock to be supplied to an operation unit formed in the semiconductor chip from a first frequency to a second frequency higher than the first frequency,

wherein the operation unit outputs a first request, a second request, and an initializing signal, the controller calculating the reference temperature according to the first request, the controller acquiring the measured temperature according to the second request, and the controller being initialized according to the initializing signal.

20. The method for controlling the semiconductor device according to claim 19 , further comprising a process of switching, when the measured temperature is lower than the first reference temperature, the frequency of the operation clock from the second frequency to the first frequency.

21. The method for controlling the semiconductor device according to claim 19 , further comprising a process of not switching, when the measured temperature is higher than the first reference temperature and lower than the second reference temperature, the frequency of the operation clock.

Assignments (2)
CHANGE OF ADDRESS Recorded Nov 29, 2017
From: RENESAS ELECTRONICS CORPORATION
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 044928/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 12, 2015
From: GOMI, TAKAHIKO; SUZUKI, TETSUYA
To: RENESAS ELECTRONICS CORPORATION
Reel/Frame 035829/0716 →
Continuity (1)
Related Publication 20150333758A1 · Nov 19, 2015