POLISHING PAD PRODUCTION METHOD
The present invention includes a polishing pad production method comprising a step of forming one or more grooves in a surface of a polishing layer comprising a flexible polyurethane foam, wherein the flexible polyurethane foam has an Asker D hardness of 30 or less at 25° C., and the step comprises a step 1 of cooling the polishing layer to adjust the Asker D hardness of the flexible polyurethane foam to 35 or more, and a step 2 of forming one or more grooves in the surface of the polishing layer comprising the flexible polyurethane foam, the Asker D hardness of which has been adjusted by the cooling. According to the polishing pad production method of the present invention, it is possible to provide a polishing pad production method capable of performing grooving in a polishing layer with a high precision when the polishing layer comprises a flexible polyurethane foam.
1 . A polishing pad production method, comprising a step of forming one or more grooves in a surface of a polishing layer comprising a flexible polyurethane foam,
wherein the flexible polyurethane foam has an Asker D hardness of 30 or less at 25° C., and
the step comprises a step 1 of cooling the polishing layer to adjust the Asker D hardness of the flexible polyurethane foam to 35 or more, and
a step 2 of forming one or more grooves in the surface of the polishing layer comprising the flexible polyurethane foam, the Asker D hardness of which has been adjusted by the cooling.
2 . The polishing pad production method according to claim 1 , wherein in the step 1, the cooled polishing layer has a temperature of 20° C. or lower.
3 . A grooving method for a polishing pad having one or more grooves in a surface of a polishing layer comprising a flexible polyurethane foam,
wherein the flexible polyurethane foam has an Asker D hardness of 30 or less at 25° C.,
the grooving method for a polishing pad comprises a step 1 of cooling the polishing layer to adjust the Asker D hardness of the flexible polyurethane foam to 35 or more, and
a step 2 of forming one or more grooves in the surface of the polishing layer comprising the flexible polyurethane foam, the Asker D hardness of which has been adjusted by the cooling.
4 . The grooving method for a polishing pad according to claim 3 , wherein in the step 2, the cooled polishing layer has a temperature of 20° C. or lower.
5 . A polishing pad grooving machine for forming one or more grooves in a surface of a polishing pad,
wherein the polishing pad grooving machine comprises a grooving platen, and
the grooving platen has a cooling function.
6 . A polishing pad grooving machine for forming one or more grooves in a surface of a polishing pad,
wherein the polishing pad grooving machine comprises cooling means for cooling the inside of the polishing pad grooving machine.