IP Library Granted Patent US 10,066,060
Granted Patent B2
US 10,066,060 · App. 14/655,144 · Granted Sep 4, 2018

Production method for high-purity organosilicon compound

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Quick Facts
Patent No.
US 10,066,060
App. No.
14/655,144
Granted
Sep 4, 2018
Kind
B2
Abstract

The present invention relates to a production method for a liquid high-purity organosilicon compound, the method comprising the steps of: adding, to a mixture containing an organosilicon compound selected from a group consisting of organomodified silcones and organomodified silanes and impurities, an organic wax having affinity with the impurities and having a higher melting point than the organosilicon compound, melting and mixing while heating, and introducing the impurities into the melted organic wax; obtaining a solidified product of the organic wax by cooling the organic wax; and performing solid/liquid phase separation on the organosilicon compound and the solidified product of the organic wax. With the present invention, it is possible to provide a useful method for producing a high-purity organosilicon compound stably and on a commercial scale.

Claims (27)

1. A production method for a liquid high-purity organosilicon compound, the method comprising the steps of:

adding, to a mixture containing an organosilicon compound modified by an organic modifier having a (poly)oxyethylene site selected from the group consisting of organomodified silicones having an organic modified group containing a (poly)oxyethylene site and organomodified silanes having an organic modified group containing a (poly)oxyethylene site and impurities originating from the organic modified group, an organic wax having a (poly)oxyethylene site having affinity with the impurities and having a higher melting point than the organosilicon compound, melting and mixing while heating, and introducing the impurities into the melted organic wax;

obtaining a solidified product of the organic wax by cooling the organic wax; and

performing solid/liquid phase separation on the organosilicon compound and the solidified product of the organic wax.

2. The production method according to claim 1 , wherein the organosilicon compound is a liquid at least at 100° C.

3. The production method according to claim 1 , wherein the organic wax has a melting point of from 45° C. to 150° C.

4. The production method according to claim 1 , wherein the organic wax has an average molecular weight of at least 900.

5. The production method according to claim 1 , wherein silicon atoms of the organosilicon compound bond with organic modified groups via Si—C bonds or Si—O—C bonds.

6. The production method according to claim 1 , wherein the organosilicon compound is a compound of Formula (1):

R 1 a R 2 b L 1 c Q d SiO (4−a−b−c−d)/2   (1)

wherein R 1 represents a monovalent organic group (however, excluding R 2 , L, and Q), a hydrogen atom or a hydroxyl group; and R 2 is a substituted or unsubstituted, straight or branched monovalent hydrocarbon group having 9 to 60 carbon atoms, or the chain organosiloxane group of Formula (2-1):

wherein R 11 are each independently a substituted or unsubstituted monovalent hydrocarbon group having from 1 to 30 carbon atoms, hydroxyl groups, or hydrogen atoms and at least one of the R 11 moieties is the monovalent hydrocarbon group; t is a number in a range of 2 to 10; and r is a number in a range of 1 to 500); or the Formula (2-2):

wherein, R 11 and r are synonymous with those described above; and L 1 represents a silylalkyl group having a siloxane dendron structure expressed by Formula (3) when i=1;

wherein the R 3 moieties are each independently a substituted or unsubstituted, straight-chain or branched monovalent hydrocarbon group having from 1 to 30 carbon atoms; the R 4 moieties are each independently an alkyl group or a phenyl group having from 1 to 6 carbon atoms; Z is a divalent organic group; i is a generation of a silylalkyl group represented by L i and is an integer from 1 to k when the number of generations serving as a number of repetitions of the silylalkyl group is k; L i+1 is the silylalkyl group when i is less than k, and R 4 when i=k; and h i is a number in a range of 0 to 3); Q is a (poly)oxyethylene group-containing organic group; and

a, b, c, and d are each numbers in the ranges of 1.0≤a≤2.5, 0≤b≤1.5, 0≤c≤1.5, and 0.0001≤d≤1.5).

7. The production method according to claim 1 , wherein the organosilicon compound is obtained by reacting

(A) an organohydrogenpolysiloxane;

(B) a (poly)oxyethylene group-containing organic compound having one or more reactive unsaturated groups in each molecule; and

(C) one or more types of organic compounds selected from a group consisting of (C1) an organic compound having a number of reactive unsaturated groups greater than 1 on average in each molecule and (C2) an organic compound having one or more reactive unsaturated groups and one or more epoxy groups in each molecule (however, the use of the component (B) is optional when the component (C) contains a (poly)oxyethylene group); and the organomodified silicone is further characterized by having a silicon-bonded (poly)oxyethylene group-containing organic group and having a crosslinked structure containing a Si—C bond in a crosslinking part.

8. The production method according to claim 1 , wherein the organosilicon compound is an organomodified silicone in the form of a straight-chain (poly)oxyalkylene group-containing alternating copolymer obtained by reacting at least:

(D) an organopolysiloxane having reactive functional groups at both terminals of a molecular chain; and

(E) an organic compound having two reactive functional groups capable of reacting with the reactive functional groups positioned at both of the molecular chain terminals of the organopolysiloxane (D) in the molecule.

9. The production method according to claim 1 , wherein the organosilicon compound has a crosslinked structure containing a Si—O—C chain in the crosslinking part, and the (poly)oxyethylene group-containing organic block constituting the crosslinking part has at least two carbon atom bonds in the organic block and binds to a siloxane block with a chain, while the siloxane block consists of siloxane units in which 1 to 3 monovalent organic groups bind to silicon atoms, and the siloxane block has a least two silicon atom bonds.

10. The production method according to claim 1 , wherein the organosilicon compound is an organomodified silane represented by Formula (8):

wherein R 16 is a group selected from a hydrogen atom and substituted or unsubstituted, straight-chain or branched monovalent hydrocarbon groups having from 1 to 30 carbon atoms; X 1 is a hydrolyzable group selected from alkoxy groups, aryloxy groups, acyloxy groups, secondary amino groups, and aminoxy groups; Z 1 is a monovalent organic group differing from R 16 which is linked to the silicon atoms of general formula (8) by Si—C bonds; 1≤k≤3; 0≤j≤2; and k+j≤3.

11. The production method according to claim 1 , wherein the mixture further contains a solvent of the organosilicon compound.

12. The production method according to claim 1 , wherein a mixture containing the organosilicon compound and the impurities is treated by an acidic aqueous solution, and water and odorizing substances produced by treatment with the acidic aqueous solution are removed by heating or depressurization.

Assignments (3)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 17, 2019
From: DOW CORNING TORAY CO., LTD.
To: DOW TORAY CO., LTD.
Reel/Frame 051322/0925 →
CORRECTIVE ASSIGNMENT TO CORRECT THE THE TITLE NEEDS TO BE CORRECTED PREVIOUSLY RECORDED ON REEL 036608 FRAME 0926. ASSIGNOR(S) HEREBY CONFIRMS THE SEIKI TAMURA; TATSUO SOUDA; SAYURI SAWAYAMA; SEIJI HORI. Recorded Dec 16, 2015
From: TAMURA, SEIKI; SOUDA, TATSUO; SAWAYAMA, SAYURI; HORI, SEIJI
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 037751/0286 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 21, 2015
From: TAMURA, SEIKI; SOUDA, TATSUO; SAWAYAMA, SAYURI; HORI, SEIJI
To: DOW CORNING TORAY CO., LTD.
Reel/Frame 036608/0926 →