Curable silicone composition, cured product thereof, and optical semiconductor device
View Patent ↗The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane resin having at least two alkenyl groups in a molecule; (B) an organopolysiloxane represented by a general formula; (C) an organosiloxane (C 1 ) having silicon-bonded hydrogen atoms at both molecular terminals, an organopolysiloxane (C 2 ) having at least two silicon-bonded hydrogen atoms in a molecule, or a mixture of components (C 1 ) and (C 2 ); and (D) a hydrosilylation reaction catalyst. The curable silicone composition has excellent handleability and can form a cured product with a high refractive index and low gas permeability when cured.
1. A curable silicone composition comprising:
(A) 100 parts by mass of an organopolysiloxane resin having at least two alkenyl groups in a molecule and represented by the average unit formula:
(R 1 R 2 2 SiO 1/2 ) a (R 3 2 SiO 2/2 ) b (R 4 SiO 3/2 ) c
wherein R 1 is an alkenyl group having from 2 to 12 carbons; R 2 are the same or different, and are each an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, an aryl group having from 6 to 20 carbons, or an aralkyl group having from 7 to 20 carbons; R 3 are the same or different, and are each an alkyl group having from 1 to 12 carbons, an alkenyl group having from 2 to 12 carbons, or a phenyl group; R 4 is an aryl group having from 6 to 20 carbons or an aralkyl group having from 7 to 20 carbons; and a, b, and c are numbers that satisfy such that 0.01≦a≦0.5, 0≦b≦0.7, 0.1≦c<0.9, and a+b+c=1;
(B) from 5 to 150 parts by mass of an organopolysiloxane represented by the general formula:
wherein R 1 is as defined above; R 5 are the same or different, and are each an alkyl group having from 1 to 12 carbon atoms or a phenyl group; R 6 is an alkyl group having from 1 to 12 carbon atoms; and m is an integer from 1 to 100, n is an integer from 0 to 50, where m≧n and 1≦m+n≦100;
(C) is an organosiloxane (C 1 ) represented by the general formula:
HMe 2 SiOPh 2 SiOSiMe 2 H; or
HMe 2 SiO(Ph 2 SiO) 2.5 SiMe 2 H;
wherein Me represents a methyl group and Ph represents a phenyl group; or
(C) is a mixture of the organosiloxane (C 1 ) and an organopolysiloxane (C 2 ) having at least two silicon-bonded hydrogen atoms in a molecule and represented by the average unit formula:
(HR 5 R 6 SiO 1/2 ) d (HR 6 2 SiO 1/2 ) e (R 5 2 SiO 2/2 ) f (R 4 SiO 3/2 ) g
wherein R 4 , R 5 , and R 6 are as defined above; and d, e, f, and g are numbers that satisfy such that 0.01≦d≦0.7, 0≦e≦0.5, 0≦f≦0.7,
0.1≦g<0.9, and d+e+f+g=1;
wherein component (C) is present in the silicone composition in an amount such that the number of silicon-bonded hydrogen atoms in component (C) is from 0.1 to 5 moles per 1 mol of total alkenyl groups in components (A) and (B); and
(D) an effective amount of a hydrosilylation reaction catalyst.
2. The curable silicone composition according to claim 1 , wherein R 2 in component (A) is a phenyl group or a naphthyl group.
3. The curable silicone composition according to claim 1 , wherein R 4 in component (A) is a phenyl group or a naphthyl group.
4. The curable silicone composition according to claim 1 , wherein R 4 in component (C 2 ) is a phenyl group or a naphthyl group.
5. The curable silicone composition according to claim 1 , wherein in the mixture of components (C 1 ) and (C 2 ), a mass ratio of component (C 1 ) to component (C 2 ) is from 0.5:9.5 to 9.5:0.5.
6. A cured product produced by curing the curable silicone composition according to claim 1 .
7. An optical semiconductor device comprising an optical semiconductor element sealed by a cured product of the curable silicone composition according to claim 1 .
8. The curable silicone composition according to claim 2 , wherein R 4 in component (A) is a phenyl group or a naphthyl group.
9. The curable silicone composition according to claim 2 , wherein R 4 in component (C 2 ) is a phenyl group or a naphthyl group.
10. The curable silicone composition according to claim 3 , wherein R 4 in component (C 2 ) is a phenyl group or a naphthyl group.
11. The curable silicone composition according to claim 2 , wherein in the mixture of components (C 1 ) and (C 2 ), a mass ratio of component (C 1 ) to component (C 2 ) is from 0.5:9.5 to 9.5:0.5.
12. The curable silicone composition according to claim 3 , wherein in the mixture of components (C 1 ) and (C 2 ), a mass ratio of component (C 1 ) to component (C 2 ) is from 0.5:9.5 to 9.5:0.5.
13. The curable silicone composition according to claim 4 , wherein in the mixture of components (C 1 ) and (C 2 ), a mass ratio of component (C 1 ) to component (C 2 ) is from 0.5:9.5 to 9.5:0.5.
14. The curable silicone composition according to claim 1 , wherein 0.05≦a≦0.4, 0≦b≦0.4, 0.45≦c<0.8, and a+b+c=1.
15. The curable silicone composition according to claim 1 , wherein m is an integer from 1 to 75 and n is an integer from 0 to 25, where m≧n and 1≦m+n≦75.
16. The curable silicone composition according to claim 1 , wherein m is an integer from 1 to 50 and n is an integer from 0 to 25, where m≧n and 1≦m+n≦50.
17. The curable silicone composition according to claim 1 , wherein p is an integer from 0 to 10.
18. The curable silicone composition according to claim 1 , wherein 0.2≦d≦0.7, 0≦e≦0.4, 0≦f<0.5, 0.25≦g<0.7, and d+e+f+g=1.
19. The curable silicone composition according to claim 17 , wherein 0.2≦d≦0.7, 0≦e≦0.4, 0≦f<0.5, 0.25≦g<0.7, and d+e+f+g=1.
20. The curable silicone composition according to claim 1 , wherein component C 2 has a mass average molecular weight in terms of standard polystyrene, as measured by gel permeation chromatography, from 500 to 10,000.