Method for the new production of through holes in a layer system
View Patent ↗Introducing a through hole into a substrate ( 4 ) before coating, and performing the removal thereafter, shortens the machining times for producing a through hole ( 18 ) with a diffuser ( 13 ) and also subjects the intermediate layers to less stress.
1. A method for production of a component, the method comprising:
producing a substrate by casting;
producing a plurality of spaced through holes arranged in a hole pattern across a thickness of the substrate, each of the plurality of spaced through holes having a constant cross section over an entire thickness of the substrate;
scanning the hole pattern of the plurality of spaced through holes in a first scan with a scanning device to obtain a scanned hole pattern;
saving the scanned hole pattern of the first scan;
coating the substrate, and at least partially the plurality of spaced through holes, with a metallic material to obtain an inner metallic layer after the first scan;
removing from the plurality of spaced through holes the metallic material;
coating the inner metallic layer with an outer ceramic layer to obtain a coated outer ceramic layer after removing from the plurality of spaced holes the metallic material;
scanning and saving another hole pattern of holes on a surface of the substrate in a second scan after coating the inner metallic layer with the outer ceramic layer to obtain another scanned hole pattern;
by comparing the scanned hole pattern and the another scanned hole pattern, at least identifying the plurality of spaced through holes and determining orientations and positions of the plurality of spaced through holes; and
forming diffusers into the coated outer ceramic layer and the inner metallic layer, each diffuser being associated with a respective one of the plurality of spaced through holes.
2. The method as claimed in claim 1 , wherein the removing is performed manually.
3. The method as claimed in claim 1 , wherein each diffuser includes a portion that is an asymmetric widening of an upper part of a respective one of the plurality of spaced through holes.
4. The method as claimed in claim 1 , wherein the plurality of spaced through holes are produced in the substrate by machining.
5. The method as claimed in claim 1 , further comprising using a laser removal method comprising substantially at least 20% different pulse frequencies for producing the plurality of spaced through holes and forming the diffusers.
6. The method as claimed in claim 5 , further comprising producing the plurality of spaced through holes using pulse durations in the millisecond range.
7. The method as claimed in claim 1 , wherein material is removed by laser pulses with pulse durations in the nanosecond range or the sub-nanosecond range to form the diffusers or to remove material from the plurality of spaced through holes.
8. The method of claim 1 , further comprising performing a material-blasting process comprised of sand blasting or shot peening after the producing of the plurality of spaced through holes.
9. The method of claim 1 , wherein the diffusers extend into the substrate.
10. The method of claim 1 , further comprising removing at least ceramic material from the plurality of spaced through holes in order to finish the through holes.
11. The method of claim 10 , wherein a laser with at least 20% different pulse frequencies is used to remove the ceramic material.