Optoelectronic system

1. An optoelectronic system comprising:

an optoelectronic element, having an outermost lateral surface, a first width, an active layer, and a first electrode with an outermost surface;

an adhesive material enclosing the optoelectronic element in a configuration of exposing the outermost surface and not directly contacting the first electrode, and having a top surface, a bottom surface, and a second width larger than the first width;

a wavelength converting structure contacting the bottom surface; and

a substrate having a portion contacting the top surface,

wherein the portion of the substrate and the first electrode are arranged at opposite sides of the active layer.

2. The optoelectronic system of claim 1 , wherein the adhesive material has a sidewall through which light emitted from the optoelectronic element is configured to escape from the optoelectronic system.

3. The optoelectronic system of claim 1 , further comprising a fan-out electrode with an end exceeding beyond the outermost lateral surface.

4. The optoelectronic system of claim 1 , wherein the wavelength converting structure substantially extends to a sidewall of the adhesive material.

5. The optoelectronic system of claim 1 , wherein a ratio of the first width to the second width is A; 0.5≦A≦1.

6. The optoelectronic system of claim 1 , wherein the adhesive material comprises silicone rubber, silicone resin, elastic PU, porous PU, or acrylic rubber.

7. The optoelectronic system of claim 1 , wherein the substrate comprises silicone, glass, quartz, or ceramic.

8. The optoelectronic system of claim 1 , wherein the wavelength converting structure comprises a first phosphor layer and a second phosphor layer overlapping the first phosphor layer.

9. The optoelectronic system of claim 1 , wherein the wavelength converting structure comprises a first phosphor powder and a second phosphor powder.

10. The optoelectronic system of claim 1 , wherein the adhesive material is formed in a structure comprising a flat surface on which the substrate is formed.

11. The optoelectronic system of claim 1 , wherein the substrate directly contacts the adhesive material.

12. The optoelectronic system of claim 1 , further comprising a fan-out electrode directly formed on the electrode and extending beyond the outermost lateral surface.

13. The optoelectronic system of claim 1 , further comprising a fan-out electrode which is directly formed on the electrode and not directly connected to the wavelength converting structure.

14. The optoelectronic system of claim 1 , further comprising a fan-out electrode having a width greater than that of the electrode.

15. The optoelectronic system of claim 1 , wherein the optoelectronic element comprises a second electrode, the first electrode and the second electrode are arranged at a same side of the active layer.