Biometric Image Sensor Packaging and Mounting
A method for providing a biometric sensor arrangement includes: forming the biometric sensor comprising sensor elements and a controller IC disposed on a substrate; at least partially enclosing the biometric sensor within a molded body; depositing capping material on the biometric sensor to form a capping layer on the biometric sensor; embossing the capping material of the capping layer; and curing the capping layer.
1 . A method for providing a biometric sensor arrangement, the method comprising:
forming the biometric sensor comprising sensor elements and a controller integrated circuit (IC) disposed on a substrate;
at least partially enclosing the biometric sensor within a molded body;
depositing capping material on the biometric sensor to form a capping layer on the biometric sensor;
embossing the capping material of the capping layer; and
curing the capping layer.
2 . The method of claim 1 , wherein the biometric sensor comprises at least one of a ball grid array (“BGA”) type package and a chip on flex (“COF”) type IC mounting.
3 . The method of claim 1 , wherein the substrate is a flexible substrate comprising a polyimide film and/or a flexible printed circuit board.
4 . The method of claim 1 , wherein mold material of the molded body comprises a molding compound, polycarbonate, Nylon, and/or glass-fiber enforced Nylon.
5 . The method of claim 1 , wherein at least partially enclosing the biometric sensor within the molded body comprises: forming sidewalls of the biometric sensor arrangement.
6 . The method of claim 1 , wherein the capping layer comprises poly(methyl methacrylate), urethane acrylate/acrylate blend, and/or an epoxy-based resin.
7 . The method of claim 1 , wherein a thickness of the capping layer is less than 200 microns.
8 . The method of claim 1 , wherein a thickness of the capping layer is based on mold structure, mold pressure and/or mold temperature.
9 . The method of claim 1 , wherein a thickness of the capping layer is based on viscosity of the capping material and/or curing properties of the capping material.
10 . The method of claim 1 , wherein the molded body comprises a soft mold and/or a hard mold, and wherein the molded body comprises a smooth surface and/or a textured pattern.
11 . The method of claim 1 , wherein the capping layer comprises a high dielectric material configured to increase permittivity between the biometric sensor and an object being sensed.
12 . A biometric sensor arrangement, comprising:
a biometric sensor, the biometric sensor comprising:
a substrate,
sensor elements disposed on the substrate, and
a controller integrated circuit (IC) disposed on the substrate;
a molded body at least partially enclosing the biometric sensor; and
a capping material disposed on the biometric sensor forming a capping layer on the biometric sensor, wherein the capping material is embossed in the capping layer, and wherein the capping layer is cured.
13 . A biometric sensor arrangement, comprising:
a biometric sensor, the biometric sensor comprising:
sensor elements in communication with a controller integrated circuit (IC);
a molded body at least partially enclosing the biometric sensor, the molded body having an opening corresponding to the sensor elements of the biometric sensor; and
a capping layer disposed on the biometric sensor at the opening, the capping layer comprising a capping material imprinted over the sensor elements.
14 . The biometric sensor arrangement of claim 13 , further comprising:
a decorative layer disposed over the sensor elements.
15 . The biometric sensor arrangement of claim 14 , further comprising:
a hard coat disposed over the sensor elements,
wherein the decorative layer is disposed over the capping layer and the hard coat is disposed over the decorative layer.
16 . The biometric sensor arrangement of claim 14 , wherein the capping layer is disposed over the decorative layer.
17 . The biometric sensor arrangement of claim 13 , wherein the capping layer has a smooth upper surface.
18 . The biometric sensor arrangement of claim 13 , wherein the capping layer has a textured upper surface.
19 . The biometric sensor arrangement of claim 13 , wherein the capping layer comprises:
a lower surface facing towards the sensor elements, the lower surface having a pattern conforming to a pattern formed by the sensor elements, and
an upper surface facing away from the sensor elements, the upper surface having a pattern different from the pattern formed by the sensor elements.
20 . The biometric sensor arrangement of claim 13 , wherein the capping layer comprises a cured resin.
21 . The biometric sensor arrangement of claim 13 , wherein the capping layer comprises poly(methyl methacrylate), urethane acrylate/acrylate blend, and/or an epoxy-based resin.
22 . The biometric sensor arrangement of claim 13 , wherein the sensor elements and the controller IC are disposed within the molded body.
23 . The biometric sensor arrangement of claim 13 , wherein the sensor elements are disposed within the molded body and the controller IC is disposed outside of the molded body.
24 . The biometric sensor arrangement of claim 13 ,
wherein the biometric sensor further comprises a substrate, and
wherein the sensor elements and the controller IC are disposed on the substrate.
25 . The biometric sensor arrangement of claim 24 ,
wherein the sensor elements include conductive traces formed on the substrate,
wherein the conductive traces include capacitive drive and pickup plates configured to capture an image of a fingerprint, and
wherein the controller IC is mounted to the substrate and connected to the conductive traces.