High-power laser diode isolation and thermal management
View Patent ↗In various embodiments, a laser apparatus includes a beam emitter, first and second mounts disposed on opposing sides of the beam emitter and in electrical and thermal contact therewith, and a housing body for conducting heat away from the beam emitter.
1. A laser apparatus comprising:
a beam emitter having first and second opposed surfaces;
a first electrode mount disposed beneath and in thermal and electrical contact with the first surface of the beam emitter;
a second electrode mount (i) disposed over and in thermal and electrical contact with the second surface of the beam emitter and (ii) electrically insulated from the first electrode mount;
a thermally and electrically conductive housing body disposed beneath the first electrode mount;
an insulating layer (i) disposed over the housing body, (ii) electrically insulating the housing body from the first electrode mount, and (iii) providing thermal conductivity between the first electrode mount and the housing body; and
a thermal bonding layer disposed between the insulating layer and the first electrode mount, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the insulating layer, and (ii) being electrically conductive.
2. The laser apparatus of claim 1 , wherein the beam emitter comprises a diode bar emitting a plurality of discrete beams.
3. The laser apparatus of claim 1 , wherein the first and second electrode mounts comprise copper.
4. The laser apparatus of claim 1 , wherein the housing body comprises aluminum.
5. The laser apparatus of claim 1 , wherein the insulating layer comprises at least one of aluminum nitride or aluminum oxide.
6. The laser apparatus of claim 1 , wherein the insulating layer comprises aluminum nitride, and further comprising (i) a first interfacial layer disposed between the insulating layer and the thermal bonding layer and (ii) a second interfacial layer disposed between the insulating layer and the housing body.
7. The laser apparatus of claim 6 , wherein the first and second interfacial layers comprise copper.
8. The laser apparatus of claim 6 , further comprising a second thermal bonding layer disposed between the second interfacial layer and the housing body.
9. The laser apparatus of claim 8 , wherein the second thermal bonding layer comprises at least one of indium or silver.
10. The laser apparatus of claim 1 , wherein the thermal bonding layer comprises at least one of indium or silver.
11. The laser apparatus of claim 1 , wherein the housing body defines therewithin one or more cooling channels for the flow of cooling fluid therethrough.
12. A laser apparatus comprising:
a beam emitter having first and second opposed surfaces;
a first electrode mount disposed beneath and in thermal and electrical contact with the first surface of the beam emitter, the first electrode mount comprising copper;
a second electrode mount (i) disposed over and in thermal and electrical contact with the second surface of the beam emitter, (ii) electrically insulated from the first electrode mount, and (iii) comprising copper;
a thermally and electrically conductive housing body disposed beneath the first electrode mount, the housing body comprising aluminum;
an insulating layer (i) disposed over the housing body, (ii) electrically insulating the housing body from the first electrode mount, (iii) providing thermal conductivity between the first electrode mount and the housing body, and (iv) comprising aluminum nitride;
a thermal bonding layer disposed between the insulating layer and the first electrode mount, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the insulating layer, (ii) being electrically conductive, and (iii) comprising at least one of indium or silver;
a first interfacial layer disposed between the insulating layer and the thermal bonding layer, the first interfacial layer comprising copper; and
a second interfacial layer disposed between the insulating layer and the housing body, the second interfacial layer comprising copper.
13. The laser apparatus of claim 12 , further comprising a second thermal bonding layer disposed between the second interfacial layer and the housing body, the second thermal bonding layer (i) improving thermal conduction between the insulating layer and the housing body, (ii) being electrically conductive, and (iii) comprising at least one of indium or silver.
14. The laser apparatus of claim 12 , wherein the housing body defines therewithin one or more cooling channels for the flow of cooling fluid therethrough.
15. The laser apparatus of claim 12 , wherein the beam emitter comprises a diode bar emitting a plurality of discrete beams.
16. A wavelength beam combining laser system comprising:
a beam emitter emitting a plurality of discrete beams and having first and second opposed surfaces;
focusing optics for focusing the plurality of beams onto a dispersive element;
a dispersive element for receiving and dispersing the received focused beams;
a partially reflective output coupler positioned to receive the dispersed beams, transmit a portion of the dispersed beams therethrough as a multi-wavelength output beam, and reflect a second portion of the dispersed beams back toward the dispersive element;
a first electrode mount disposed beneath and in thermal and electrical contact with the first surface of the beam emitter;
a second electrode mount (i) disposed over and in thermal and electrical contact with the second surface of the beam emitter and (ii) electrically insulated from the first electrode mount;
a thermally and electrically conductive housing body disposed beneath the first electrode mount;
an insulating layer (i) disposed over the housing body, (ii) electrically insulating the housing body from the first electrode mount, and (iii) providing thermal conductivity between the first electrode mount and the housing body; and
a thermal bonding layer disposed between the insulating layer and the first electrode mount, the thermal bonding layer (i) improving thermal conduction between the first electrode mount and the insulating layer, and (ii) being electrically conductive.
17. The laser system of claim 16 , wherein the dispersive element comprises a diffraction grating.
18. The laser system of claim 16 , wherein the first and second electrode mounts comprise copper.
19. The laser system of claim 16 , wherein the housing body comprises aluminum.
20. The laser system of claim 16 , wherein the insulating layer comprises at least one of aluminum nitride or aluminum oxide.
21. The laser system of claim 16 , wherein the insulating layer comprises aluminum nitride, and further comprising (i) a first interfacial layer disposed between the insulating layer and the thermal bonding layer and (ii) a second interfacial layer disposed between the insulating layer and the housing body.
22. The laser system of claim 21 , wherein the first and second interfacial layers comprise copper.
23. The laser system of claim 21 , further comprising a second thermal bonding layer disposed between the second interfacial layer and the housing body.
24. The laser system of claim 23 , wherein the second thermal bonding layer comprises at least one of indium or silver.
25. The laser system of claim 16 , wherein the thermal bonding layer comprises at least one of indium or silver.
26. The laser system of claim 16 , wherein the housing body defines therewithin one or more cooling channels for the flow of cooling fluid therethrough.