Imaging module and endoscope device

1. An imaging module, comprising:

a solid-state imaging element including a light receiving face for receiving light on a surface of the solid-state imaging element;

a glass lid attached to the solid-state imaging element so as to cover the light receiving face of the solid-state imaging element;

a mounting substrate including a connection portion which is located inside an imaging element projection area that is a projection area where the solid-state imaging element is projected in an optical axis direction of the solid-state imaging element and which is connected and fixed to a back surface of the solid-state imaging element on a distal end side of the mounting substrate, the mounting substrate on a rear end side being extended in the optical axis direction;

a connection substrate that is configured to electrically connect the mounting substrate to the solid-state imaging element;

a plurality of electronic components mounted on the mounting substrate;

a metallic reinforcing member that has a sleeve shape open at both ends and covers the solid-state imaging element and the connection portion of the mounting substrate along the optical axis direction in a state where an inner circumferential surface of the reinforcing member is away from the solid-state imaging element and the mounting substrate; and

a solid-state imaging element holder in which an outer circumferential surface of the glass lid is fitted into an inner circumferential surface of a proximal end side of the solid-state imaging element holder to hold the solid-state imaging element, the inner circumferential surface of a distal end side of the reinforcing member being fitted into an outer circumferential surface of the proximal end side of the solid-state imaging element holder, wherein

on a rear end side of the connection portion, the mounting substrate includes a protrusion portion that protrudes outside of the imaging element projection area in a state where the protrusion portion is away from a rear end of the reinforcing member by a specified distance or more, and

on the rear end side of the connection portion, the plurality of electronic components are mounted on the mounting substrate such that a longitudinal direction of the plurality of electronic components is perpendicular to the optical axis direction, and the plurality of electronic components are arranged away from the rear end of the reinforcing member by the specified distance or more.

2. The imaging module according to claim 1 , wherein the protrusion portion is located inside a reinforcing member projection area that is a projection area where an outer circumference of the reinforcing member is projected in the optical axis direction.

3. The imaging module according to claim 1 , wherein a signal cable that is configured to be electrically connected to the solid-state imaging element is connected to the mounting substrate.

4. The imaging module according to claim 1 , wherein the mounting substrate is a rigid substrate.

5. An endoscope device including an insertion portion provided with an imaging module at a distal end of the insertion portion, the imaging module comprising:

a solid-state imaging element including a light receiving face for receiving light on a surface of the solid-state imaging element;

a glass lid attached to the solid-state imaging element so as to cover the light receiving face of the solid-state imaging element;

a mounting substrate including a connection portion which is located inside an imaging element projection area that is a projection area where the solid-state imaging element is projected in an optical axis direction of the solid-state imaging element and which is connected and fixed to a back surface of the solid-state imaging element on a distal end side of the mounting substrate, the mounting substrate on a rear end side being extended in the optical axis direction;

a connection substrate that is configured to electrically connect the mounting substrate to the solid-state imaging element;

a plurality of electronic components mounted on the mounting substrate;

a metallic reinforcing member that has a sleeve shape open at both ends and covers the solid-state imaging element and the connection portion of the mounting substrate along the optical axis direction in a state where an inner circumferential surface of the reinforcing member is away from the solid-state imaging element and the mounting substrate; and

a solid-state imaging element holder in which an outer circumferential surface of the glass lid is fitted into an inner circumferential surface of a proximal end side of the solid-state imaging element holder to hold the solid-state imaging element, the inner circumferential surface of a distal end side of the reinforcing member being fitted into an outer circumferential surface of the proximal end side of the solid-state imaging element holder, wherein

on a rear end side of the connection portion, the mounting substrate includes a protrusion portion that protrudes outside of the imaging element projection area in a state where the protrusion portion is away from a rear end of the reinforcing member by a specified distance or more, and

on the rear end side of the connection portion, the plurality of electronic components are mounted on the mounting substrate such that a longitudinal direction of the plurality of electronic components is perpendicular to the optical axis direction, and the plurality of electronic components are arranged away from the rear end of the reinforcing member by the specified distance or more.