Substrate treatment method and substrate treatment apparatus

Inventors: Kenji Kobayashi (Kyoto, JP); Manabu Okutani (Kyoto, JP)

H01L21/67248 C23C16/458 C23C16/46 C23C16/52 H01L21/02057 H01L21/30604 H01L21/324 H01L21/6704 H01L21/67028 H01L21/67034 H01L21/67051 H01L21/67075 H01L21/67103 H01L21/67109 H01L21/67253 H01L21/67303 H01L21/68728 H01L21/68792

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Quick Facts

Patent No.: US 9,698,031
App. No.: 14/667,769
Granted: Jul 4, 2017
Kind: B2

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Abstract

A substrate treatment method is provided, which includes: an organic solvent replacing step of supplying an organic solvent, whereby a liquid film of the organic solvent is formed on the substrate as covering the upper surface of the substrate to replace a rinse liquid with the organic solvent; a substrate temperature increasing step of allowing the temperature of the upper surface of the substrate to reach a first temperature level higher than the boiling point of the organic solvent after the formation of the organic solvent liquid film, whereby a vapor film of the organic solvent is formed below the entire organic solvent liquid film between the organic solvent liquid film and the substrate to levitate the organic solvent liquid film above the organic solvent vapor film; and an organic solvent removing step of removing the levitated organic solvent liquid film from above the upper surface of the substrate.

Claims (6)

1. A substrate treatment method comprising:

an organic solvent replacing step of supplying, to an upper surface of a horizontally held substrate, an organic solvent having a lower surface tension than a rinse liquid adhering to the upper surface of the substrate, whereby a liquid film of the organic solvent is formed on the substrate as covering the upper surface of the substrate to replace the rinse liquid with the organic solvent;

a substrate temperature increasing step of allowing a temperature of the upper surface of the substrate to reach a predetermined first temperature level higher than a boiling point of the organic solvent after the formation of the organic solvent liquid film, whereby a vapor film of the organic solvent is formed below the entire organic solvent liquid film between the organic solvent liquid film and the upper surface of the substrate, to levitate the organic solvent liquid film without disintegration, as a liquid mass, above the organic solvent vapor film; and

an organic solvent removing step of removing the undisintegrated levitated organic solvent liquid film from above the upper surface of the substrate;

wherein the organic solvent removing step includes a first step of removing the undisintegrated levitated organic solvent liquid film in the form of said liquid mass from above the upper surface of the substrate; and

wherein the first step includes a step of contacting a guide surface of a guide member to a peripheral portion of the undisintegrated levitated organic solvent liquid film so that the organic solvent liquid film is guided to move laterally off the substrate.

Assignments (1)

ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 10, 2015

From: KOBAYASHI, KENJI; OKUTANI, MANABU

To: SCREEN HOLDINGS CO., LTD.

Reel/Frame 036286/0892 →

Priority Claims (1)

JP 2014-062400 · Mar 25, 2014 · national

Continuity (1)

Related Publication 20150279708A1 · Oct 1, 2015