Semiconductor device

1. A device, comprising:

a semiconductor chip having a first conduction element;

a printed circuit board having second and third conduction elements, the printed circuit board having a top side and a bottom side, wherein the second conduction element extends through the printed circuit board from the top side of the printed circuit board to the bottom side of the printed circuit board, and wherein the third conduction element extends across the top side of the printed circuit board;

external connection elements connected directly to the first, second and third conduction elements,

wherein the external connection elements are configured to form an electrical path between the first, second and third conduction elements, wherein the external connection elements comprise first, second and third solder balls aligned along a same linear direction, and the electrical path is formed from the second conduction element to the first solder ball, to the first conduction element, to the second solder ball, to the third conduction element, to the third solder ball, and wherein centers of the first, second and third solder balls are co-planar with one another; and

a fourth solder ball coupled to the second conduction element at the bottom side of the printed circuit board.

2. The device of claim 1 , wherein the printed circuit board further comprises a fourth conduction element located between and electrically isolated from the second and third conduction elements, and a vertical projection of the fourth conduction element crosses the first conduction element.

3. The device of claim 2 , wherein the second, third, and fourth conduction elements are formed from a common conduction layer.

4. The device of claim 1 , wherein the external connection elements are located at positions defining an array.