Thermal management
View Patent ↗A solar energy receiver can include a heat sink configured to cool or otherwise dissipate heat. The heat sink can include a plurality of fin members, each having bases that are generally aligned with each other. The bases of the fin members can be connected to one another with connection devices that are spaced away from the bases, so as to improve thermal conductivity performance characteristics.
1. A photovoltaic receiver comprising:
a photo-sensitive device configured to convert sunlight into electrical energy;
a first fin comprising a first heat discharge portion configured to discharge heat energy through convective loss, a first base having a proximal portion connected to the first heat discharge portion and extending at an angle transverse to the first heat discharge portion, the first base comprising a first outer base surface facing away from the first heat discharge portion, a first distal portion and a first connector portion connected to the first distal portion and extending from the first distal portion at an angle transverse to the first distal portion; and
a second fin comprising a second heat discharge portion configured to discharge heat energy through convective loss, a second base having a proximal portion connected to the second heat discharge portion, the second base including a second outer base surface facing away from the second heat discharge portion, the first and second outer base surfaces being substantially aligned along a plane and thermally connected to the photo-sensitive device,
wherein the first connector portion is engaged with the second heat discharge portion at a location spaced away from the plane and away from the first distal portion of the first base,
wherein the first connector portion comprises a plurality of projections extending from the distal portion of the first connector portion.
2. The receiver according to claim 1 , wherein the photo-sensitive device comprises a plurality of photovoltaic cells encased within an encapsulant material, the first and second outer base surfaces being thermally connected to an outer surface of the encapsulant material.
3. The receiver according to claim 1 , wherein the first connector portion comprises a proximal portion connected to the distal portion of the first base and a distal portion, wherein the location is disposed at the distal portion of the first connector portion.
4. The receiver according to claim 1 , wherein the second heat discharge portion comprises a plurality of apertures disposed on the second heat discharge portion at a second location spaced away from the plane and engaged with the plurality of projections.
5. The receiver according to claim 1 , wherein the location is spaced away from the plane by at least 2 mm.
6. The receiver according to claim 5 , additionally comprising a thermally conductive material disposed between the plane and the photo-sensitive device.
7. The receiver according to claim 6 , wherein at least a portion of the thermally conductive material is disposed directly between the first and second bases.
8. The receiver according to claim 7 , wherein the thermally conductive material is not in direct contact with the location.
9. The receiver according to claim 1 , wherein the first connector portion comprises a planar portion extending parallel to the second heat discharge portion, the location being on the planar portion of the first connector portion.
10. The receiver according to claim 9 , wherein at least a first portion of the planar portion is disposed between the distal portion of the first base and the location.
11. A heat sink assembly comprising;
a first fin comprising a first heat discharge portion configured to discharge heat energy through convective loss, a first base having a proximal portion connected to the first heat discharge portion and extending at an angle transverse to the first heat discharge portion, the first base comprising an outer base surface facing away from the first heat discharge portion, a first distal portion and a first connector portion connected to the first distal portion and extending from the first distal portion at an angle transverse to the first distal portion; and
a second fin comprising a second heat discharge portion configured to discharge heat energy through convective loss, a second base having a proximal portion connected to the second heat discharge portion, the second base including
a second outer base surface facing away from the second heat discharge portion, the first and second outer base surfaces being substantially aligned along a plane and configured to be thermally connected to a photo-sensitive device;
wherein the first connector portion is engaged with the second heat discharge portion at a location spaced away from the plane and away from the first distal portion of the first base,
wherein the first connector portion comprises a plurality of projections extending from the distal portion of the first connector portion.
12. The assembly according to claim 11 , wherein the first connector portion comprises a proximal portion connected to the distal portion of the first base and a distal portion, wherein the location is disposed at the distal portion of the first connector portion.
13. The assembly according to claim 11 , wherein the second heat discharge portion comprises a plurality of apertures disposed on the second heat discharge portion at a second location spaced away from the plane and engaged with the plurality of projections.
14. The assembly according to claim 11 , wherein the location is spaced away from the plane by at least 2 mm.
15. The assembly according to claim 11 , wherein the first connector portion comprises a planar portion extending parallel to the second heat discharge portion, the location being on the planar portion of the first connector portion.
16. The assembly according to claim 15 , wherein at least a first portion of the planar portion is disposed between the distal portion of the first base and the location.
17. The assembly according to claim 11 , in combination with a laminate comprising a photovoltaic cell and encapsulant material in thermal communication with the first and second bases.