Image pickup apparatus and endoscope including the same
View Patent ↗An image pickup device including a vacant space portion that allows a connection electrode to be exposed to a second main surface side, the vacant space portion being formed at a position overlapping at least the connection electrode in a state where the image pickup device is viewed in plan view from a thickness direction A, and the connection electrode exposed to the second main surface side is electrically connected with a substrate at a position in the vacant space portion, the position overlapping the image pickup device in the state where the image pickup device is viewed in plan view from the thickness direction.
1. An image pickup apparatus comprising:
an image pickup device having a first main surface and a second main surface on an opposite side of the first main surface, a light-receiving portion and a connection electrode are formed on the first main surface, the connection electrode having a front face and a rear face on an opposite side of the front face, the rear face abutting the first main surface;
a cover glass adhered to the first main surface of the image pickup device through a transparent bonding layer; and
a substrate electrically connected with the connection electrode,
wherein the image pickup device is provided with a vacant space portion, the vacant space portion being open to a second main surface side of the image pickup device, the front face of the connection electrode is covered by the bonding layer, the rear face of the connection electrode is exposed through the vacant space portion, and a distal end portion of the substrate inserted into the vacant space portion is electrically connected with the rear face of the connection electrode.
2. The image pickup apparatus according to claim 1 , wherein
the vacant space portion is formed by an opening formed on the image pickup device along the thickness direction at the position overlapping at least the connection electrode in the state where the image pickup device is viewed in plan view from the thickness direction, and
the rear face of the connection electrode is exposed to the second main surface side through the opening.
3. The image pickup apparatus according to claim 1 , wherein
the vacant space portion is formed by a cutout formed by cutting the position overlapping at least the connection electrode in the state where the image pickup device is viewed in plan view from the thickness direction and also cutting an end surface of the image pickup device in a direction perpendicular to the thickness direction, and
the rear face of connection electrode is exposed to the second main surface side through the cutout.
4. The image pickup apparatus according to claim 1 , wherein
the substrate is electrically and directly connected to the connection electrode.
5. The image pickup apparatus according to claim 1 , wherein
the substrate is electrically connected to the connection electrode through a wiring extended from the connection electrode.
6. The image pickup apparatus according to claim 5 , wherein the substrate is electrically connected to the wiring extended to an end surface which is formed on the image pickup device by forming the vacant space portion and inclined at an acute angle with respect to the first main surface, or extended to an end surface which is formed on the image pickup device by forming the vacant space portion and perpendicular to the first main surface.
7. The image pickup apparatus according to claim 1 , wherein
the substrate is electrically connected to the connection electrode through an extension electrode extended from the substrate.
8. The image pickup apparatus according to claim 1 , wherein
the substrate is connected with another component, and
the substrate and the other component are located so as to be away from the second main surface of the image pickup device in the thickness direction in such a manner that an entirety of the substrate and the other component overlaps over the image pickup device when the image pickup device is viewed in plan view from the thickness direction.
9. An endoscope comprising the image pickup apparatus according to claim 1 .
10. The image pickup apparatus according to claim 1 , wherein the vacant space portion is formed at a position where the vacant space portion overlaps the connection electrode when viewed in a plan view in a direction of thickness of the image pickup device, and the rear face of the connection electrode is exposed to the second main surface side by the vacant space portion.
11. The image pickup apparatus according to claim 1 , wherein the vacant space portion is formed at a position where the vacant space portion overlaps the connection electrode when viewed in a plan view in a direction of thickness of the image pickup device, and the connection electrode and the substrate are electrically connected with each other in the vacant space portion.