LED assembly and LED bulb using the same
View Patent ↗An LED assembly, comprising: a light-transmissive substrate comprising a surface, a central region and a peripheral region surrounding the central region; a heat dissipation element, wherein a portion of the heat dissipation element is corresponding to the central region of the light-transmissive substrate; a first wavelength conversion layer arranged on the surface of the light-transmissive substrate and corresponding to the peripheral region of the light-transmissive substrate; a plurality of LED elements arranged on the first wavelength conversion layer; a second wavelength conversion layer arranged on the surface of the light-transmissive substrate and covering the plurality of LED elements and the first wavelength conversion layer; a plurality of conductive structures surrounding the plurality of LED elements and electrically connected thereto, wherein the plurality of conductive structures is formed on the surface and separated from each other; and a plurality of electrical contacts electrically connected to the plurality of conductive structures respectively.
1. An LED assembly, comprising:
a light-transmissive substrate comprising a surface, a central region and a peripheral region surrounding the central region;
a heat dissipation element, wherein a portion of the heat dissipation element is corresponding to the central region of the light-transmissive substrate;
a first wavelength conversion layer arranged on the surface of the light-transmissive substrate and corresponding to the peripheral region of the light-transmissive substrate;
a plurality of LED elements arranged on the first wavelength conversion layer;
a second wavelength conversion layer arranged on the surface of the light-transmissive substrate and covering the plurality of LED elements and the first wavelength conversion layer;
a plurality of conductive structures surrounding the plurality of LED elements and electrically connected thereto, wherein the plurality of conductive structures is formed on the surface and separated from each other; and
a plurality of electrical contacts electrically connected to the plurality of conductive structures respectively.
2. The LED assembly as claimed in claim 1 , wherein the first wavelength conversion layer comprises a phosphor.
3. The LED assembly as claimed in claim 1 , wherein the first wavelength conversion layer comprises a transparent glue and a phosphor dispersed therein.
4. The LED assembly as claimed in claim 2 , wherein the phosphor comprises multi-chromatic phosphor.
5. The LED assembly as claimed in claim 1 , wherein the light-transmissive substrate comprises a through hole.
6. The LED assembly as claimed in claim 5 , wherein the through hole is disposed in the central region.
7. The LED assembly as claimed in claim 1 , wherein the LED elements are arranged as four sides of the rectangle, a circular closed loop or zig-zag.
8. The LED assembly as claimed in claim 1 , wherein the electrical contacts comprise a first electrical contact and a second electrical contact.
9. The LED assembly as claimed in claim 5 , wherein the electrical contacts comprise a first electrical contact and a second electrical contact respectively arranged between the through hole and the plurality of LED elements.
10. The LED assembly as claimed in claim 9 , further comprising a third electrical contact and a fourth electrical contact arranged outside the conductive structures.
11. The LED assembly as claimed in claim 9 , wherein the first electrical contact and the second electrical contact are arranged symmetrically along a diagonal line of the light-transmissive substrate with the through hole as the geometric center.
12. The LED assembly as claimed in claim 1 , wherein the heat dissipation element comprises a hollow column.
13. The LED assembly as claimed in claim 5 , further comprising a pair of wires passing through the through hole.
14. The LED assembly as claimed in claim 13 , wherein the heat dissipation element comprises a hollow column and the pair of wires pass through the hollow column.
15. The LED assembly as claimed in claim 1 , wherein the heat dissipation element comprises a thermally conductive plate.
16. The LED assembly as claimed in claim 15 , wherein the thermally conductive plate is attached to the light-transmissive substrate.
17. The LED assembly as claimed in claim 1 , wherein the LED elements further comprise a plurality of pitches, and the pitches are narrower when the LED elements are closer to the heat dissipation element.
18. The LED assembly as claimed in claim 1 , wherein the LED elements further comprise a plurality of pitches, and the pitches are narrower when the LED elements are closer to the peripheral region of the light-transmissive substrate.
19. The LED assembly as claimed in claim 1 , further comprising an aligned mark disposed on the light-transmissive substrate.
20. An LED bulb, comprising:
a base;
a lampshade connected to the base and defined as a housing space; and
the LED assembly as claimed in claim 1 disposed in the housing space and electrically connected to the base.
21. The LED assembly as claimed in claim 1 , wherein a respective area of the first wavelength conversion layer and the second wavelength conversion layer is greater than a total area of the LED elements.