Bearing assemblies including a thermally conductive structure, bearing apparatuses, and methods of use
View Patent ↗Embodiments of the invention are directed to bearing assemblies configured to effectively provide heat distribution from and/or heat dissipation for bearing element, bearing apparatuses including such bearing assemblies, and methods of operating such bearing assemblies and apparatuses. In an embodiment, a bearing assembly includes a plurality of superhard bearing elements distributed about an axis. Each superhard bearing element of the plurality of superhard bearing elements has a superhard material including a superhard surface. Additionally, a support ring structure that includes a support ring that supports the plurality of superhard bearing elements and a thermally-conductive structure in thermal communication with the superhard table of each of the plurality of superhard bearing elements. The thermally-conductive structure has a higher thermal conductivity than the support ring of the support ring structure.
1. A bearing assembly, comprising:
a support ring including at least one lateral surface;
a plurality of polycrystalline diamond bearing elements each including a substrate comprising a carbide material and a polycrystalline diamond table bonded to the substrate, the plurality of polycrystalline diamond bearing elements are secured to the support ring and distributed about an axis, each of the plurality of polycrystalline diamond elements including a polycrystalline diamond material having a polycrystalline diamond bearing surface;
a thermally-conductive structure that is distinct from the substrate, the thermally-conductive structure is positioned in contact with at least one lateral surface of the support ring and in thermal communication with at least one polycrystalline diamond bearing element of the plurality of polycrystalline diamond bearing elements; and
wherein the thermally-conductive structure exhibits a higher thermal conductivity than the support ring.
2. The bearing assembly of claim 1 , wherein the thermally-conductive structure is disposed in at least a portion of the support ring.
3. The bearing assembly of claim 2 , wherein the support ring includes a channel and the thermally-conductive structure is at least partially positioned in the channel.
4. The bearing assembly of claim 1 , wherein at least a portion of the support ring is enclosed by the thermally-conductive structure.
5. The bearing assembly of claim 1 , wherein the thermally-conductive structure is in direct contact with the polycrystalline diamond material of the at least one polycrystalline diamond bearing element.
6. The bearing assembly of claim 1 , wherein the thermally-conductive structure at least partially surrounds polycrystalline diamond material of at least one polycrystalline diamond bearing element of the plurality of polycrystalline diamond elements.
7. The bearing assembly of claim 1 , wherein at least a portion of the thermally-conductive structure is positioned inside at least one polycrystalline diamond bearing element of the plurality of polycrystalline diamond elements.
8. A bearing assembly, comprising:
a support ring;
a plurality of polycrystalline diamond bearing elements secured to the support ring and distributed about an axis, each of the plurality of polycrystalline diamond bearing elements including a polycrystalline diamond material having a polycrystalline diamond bearing surface;
one or more thermally-conductive structures in thermal communication with the support ring and in thermal communication with polycrystalline diamond material of at least one polycrystalline diamond bearing elements of the plurality of polycrystalline diamond bearing elements; and
wherein: the one or more thermally-conductive structures exhibit a higher thermal conductivity than the support ring; and the one or more thermally-conductive structures at least partially surround the polycrystalline diamond material of the at least one polycrystalline diamond bearing element; or the support ring includes a channel and the one or more thermally-conductive structures are at least partially positioned in the channel; or at least a portion of at least one of the one or more thermally-conductive structures is disposed inside the at least one polycrystalline diamond bearing element.
9. The bearing assembly of claim 8 , wherein at least one of the one or more thermally-conductive structures is in direct contact with the polycrystalline diamond material of the at least one polycrystalline diamond bearing element.
10. The bearing assembly of claim 8 , wherein the one or more thermally-conductive structures include a plurality of thermally-conductive structures distributed about the axis.
11. The bearing assembly of claim 10 , wherein the plurality of thermally-conductive structures are in thermal communication with one another.
12. The bearing assembly of claim 11 , wherein each of the plurality of thermally-conductive structures are in direct contact with each directly adjacent thermally-conductive structure of the plurality of thermally-conductive structures.
13. The bearing assembly of claim 8 , wherein the one or more thermally-conductive structures is disposed in at least a portion of the support ring.
14. The bearing assembly of claim 8 , wherein at least a portion of the support ring is surrounded by the one or more thermally-conductive structures.
15. A bearing assembly, comprising:
a support ring;
a plurality of polycrystalline diamond bearing elements secured to the support ring and distributed about an axis, each of the plurality of polycrystalline diamond bearing elements including a polycrystalline diamond table having a polycrystalline diamond bearing surface;
one or more thermally-conductive structures positioned in contact with at least one surface of the support ring and in contact with the polycrystalline diamond table of at least one polycrystalline diamond bearing elements of the plurality of polycrystalline diamond bearing elements; and
wherein: the one or more thermally-conductive structures exhibit a higher thermal conductivity than the support ring; and at least one of the one or more thermally-conductive structures at least partially surrounds the polycrystalline diamond table of the at least one polycrystalline diamond bearing element; or at least a portion of at least one of the one or more thermally-conductive structures is disposed inside the at least one polycrystalline diamond bearing element.