Systems and methods for frequency shifting resonance of an unused via in a printed circuit board
View Patent ↗In accordance with embodiments of the present disclosure, a circuit board may include a first trace formed in a first layer of the circuit board, a second trace formed in a second layer of the circuit board, a via, and a termination pad. The via may be configured to electrically couple the first trace to the second trace, the via comprising a via stub corresponding to a first portion of a length of the via not within a second portion of the via between a first location in which the first trace is electrically coupled to the via and a second location in which the second trace is electrically coupled to the via. The termination pad may be formed at an end of the via stub opposite at least one of the first location and the second location.
1. A circuit board, comprising:
a plurality of layers including at least a first layer and a second layer;
a first trace formed in the first layer of the circuit board;
a second trace formed in the second layer of the circuit board;
a via configured to electrically couple the first trace to the second trace, wherein the via is coupled to the first trace at a first location and coupled to the second trace at a second location, the via comprising a via stub that is not located between the first layer and the second layer and is not operable to conduct signals among the plurality of layers;
a first termination pad formed at an end of the via stub opposite at least one of the first location and the second location, wherein the first termination pad is offset from a center axis of the via stub; and
one or more second termination pads formed at one or more layers of the circuit board other than the first layer and the second layer, wherein the one or more second termination pads are smaller in size than the first termination pad;
wherein the first termination pad and the one or more second termination pads are not operable to couple the via to any traces.
2. The circuit board of claim 1 , the first termination pad formed such that an effective impedance of the via stub is approximately equal to a desired impedance.
3. The circuit board of claim 2 , the first termination pad and the one or more second termination pads each formed with a respective size such that the effective impedance of the via stub is approximately equal to the desired impedance.
4. The circuit board of claim 3 , wherein the respective sizes are radii of the first termination pad and the one or more second termination pads.
5. The circuit board of claim 2 , wherein the desired impedance comprises at least one of a desired capacitance and a desired inductance.
6. The circuit board of claim 2 , wherein the desired impedance is selected such that the via stub has a desired effective resonant frequency.
7. A method, comprising:
forming a plurality of layers including at least a first layer and a second layer in a circuit board;
forming a first trace in the first layer of a circuit board;
forming a second trace in the second layer of the circuit board;
electrically coupling the first trace to the second trace with a via, wherein the via is coupled to the first trace at a first location and coupled to the second trace at a second location, the via comprising a via stub that is not located between the first layer and the second layer and is not operable to conduct signals among the plurality of layers;
forming a first termination pad at an end of the via stub opposite at least one of the first location and the second location, wherein the first termination pad is offset from a center axis of the via stub; and
forming one or more second termination pads at one or more layers of the circuit board other than the first layer and the second layer, wherein the one or more second termination pads are smaller in size than the first termination pad;
wherein the first termination pad and the one or more second termination pads are not operable to couple the via to any traces.
8. The method of claim 7 , wherein forming the first termination pad comprises forming the termination pad such that an effective impedance of the via stub is approximately equal to a desired impedance.
9. The method of claim 8 , wherein forming the first termination pad and forming the one or more second termination pads comprises forming each of the first termination pad and the one or more second termination pads with a respective size such that the effective impedance of the via stub is approximately equal to the desired impedance.
10. The method of claim 9 , wherein the respective sizes are radii of the first termination pad and the one or more second termination pads.
11. The method of claim 8 , wherein the desired impedance comprises at least one of a desired capacitance and a desired inductance.
12. The method of claim 8 , wherein the desired impedance is selected such that the via stub has a desired effective resonant frequency.
13. The method of claim 7 , wherein the one or more second termination pads comprise a plurality of second termination pads, wherein the respective sizes of each second termination pad successfully decrease from the end of the via stub.
14. The method of claim 13 , wherein differences in sizes between successive second termination pads are equal to a pre-defined ratio.
15. The circuit board of claim 1 , wherein the one or more second termination pads comprise a plurality of second termination pads, wherein the respective sizes of each second termination pad successfully decrease from the end of the via stub.
16. The circuit board of claim 15 , wherein differences in sizes between successive second termination pads are equal to a pre-defined ratio.