Method of manufacturing a floor board
View Patent ↗A method of manufacturing a floor board comprises the steps of supplying a panel, printing a curable substance or surface removing substance onto the panel in a predefined pattern for creating an elevation on the panel at the pattern or removing a portion of the surface of the panel at the pattern, respectively, and curing the curable substance or removing any re-action products of the surface removing substance and the panel.
1. A method of manufacturing a panel having an upper surface with surface portions of varying thickness, comprising:
supplying a panel;
transporting said panel to a digital printing station;
at said digital printing station, printing a liquid on said upper surface of said panel in a predefined pattern, wherein the predefined pattern substantially corresponds to a decorative basic pattern being present on the panel;
transporting said panel to a powder spreading station;
at said powder spreading station, combining a powder and said liquid by spreading said powder over said upper surface having said liquid, said predefined pattern of liquid comprising wet portions, wherein a first part of said powder sticks to said wet portions and a second part of said powder lays beside said wet portions;
transporting said panel to a powder removing station;
at said powder removing station, removing said second part of said powder, said first part of said powder together with said liquid being a curable substance; and
curing said curable substance, wherein said first part of said powder adheres to said upper surface, wherein said curing creates an elevated surface portion on said upper surface at said predefined pattern of liquid, and wherein the powder comprises wear resistant particles, a swelling powder, a metallic resin powder, a lustrous resin powder, an anti-static powder, a pearlescent effect generating powder, a matte effect generating powder or an odour effect generating powder.
2. The method according to claim 1 , wherein the powder comprises wear resistant particles.
3. The method according to claim 1 , wherein the powder comprises a swelling powder such that upon curing the curable substance the volume of the curable substance becomes larger than that of the sum of the liquid and the powder separately.
4. The method according to claim 1 , wherein said curing includes curing the curable substance using ultraviolet (UV) radiation.
5. The method according to claim 1 , wherein a maximal thickness of the curable substance is between 20 and 250 μm.
6. The method according to claim 1 , wherein a maximal thickness of the curable substance is between 5 and 1000 μm.
7. The method according to claim 1 , wherein the curable substance contains a varnish.
8. The method according to claim 1 , further comprising after creating the curable substance laminating a substrate to the panel.
9. The method of claim 8 , wherein the panel is a flexible sheet.
10. The method of claim 9 , wherein said flexible sheet is a paper sheet.
11. The method of claim 10 , further comprising providing said paper sheet with resin.
12. The method of claim 1 , wherein said curing comprises heating said curable substance by a heat source.
13. The method of claim 1 , wherein said liquid is a curable substance.
14. The method of claim 1 , wherein said powder is a curable substance.
15. The method of claim 1 , wherein said curing creates an elevated surface portion on said upper surface at said predefined pattern of liquid.
16. The method of claim 1 , wherein said panel comprises a substrate including at least one of HDF, Wood Plastic Composite, polymeric composite and polyvinyl chloride.
17. The method of claim 1 , wherein said powder comprises particles of corundum.
18. The method of claim 1 , wherein after said curing, a liquid free upper surface is obtained.