IP Library Granted Patent US 9,412,917
Granted Patent B2
US 9,412,917 · App. 14/680,631 · Granted Aug 9, 2016

Light emitting device

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Quick Facts
Patent No.
US 9,412,917
App. No.
14/680,631
Granted
Aug 9, 2016
Kind
B2
Abstract

This disclosure discloses a light-emitting device. The light-emitting device includes a transparent substrate with a recess and an upper surface; a wavelength converting layer covering the recess and the upper surface of the transparent substrate; and a light-emitting diode arranged in the recess and over the wavelength converting layer.

Claims (25)

1. A light-emitting device, comprising:

a transparent substrate comprising a recess, an upper surface, and a first bottom surface opposite to the upper surface;

a wavelength converting layer covering the recess and the upper surface;

a light-emitting diode having a side surface, and arranged over the wavelength converting layer in the recess; and

a first insulating material surrounding the side surface in a configuration exposing the light-emitting diode, and covering the wavelength converting layer.

2. The light-emitting device of claim 1 , wherein the light-emitting diode has a second bottom surface directly connected to the wavelength converting layer.

3. The light-emitting device of claim 1 , wherein the light-emitting diode has a top surface higher than the upper surface.

4. The light-emitting device of claim 1 , wherein the wavelength converting layer has a portion covered by the first insulating material and not covered by the light-emitting diode.

5. The light-emitting device of claim 4 , further comprising an electrically conductive structure electrically connected to the light-emitting diode.

6. The light-emitting device of claim 5 , wherein the light-emitting diode has a top surface, the electrically conductive structure is arranged on the top surface and outwardly extends over the first insulating layer.

7. The light-emitting device of claim 5 , further comprising a second insulating material arranged over the electrically conductive structure and the light-emitting diode.

8. The light-emitting device of claim 1 , wherein the transparent substrate comprises an insulating oxide material or ceramic material.

9. The light-emitting device of claim 1 , wherein the transparent substrate has a thermal conductivity coefficient ranged from 2 to 200 W/m·K.

10. A light-emitting device, comprising:

a transparent substrate comprising a plurality of recesses, an upper surface, and a bottom surface opposite to the upper surface

a wavelength converting layer covering the plurality of recesses and the upper surface;

a plurality of light-emitting diodes having a plurality of side surfaces, and arranged on the wavelength converting layer covering the plurality of recesses and the upper surface; and

a first insulating material surrounding the plurality of side surfaces in a configuration exposing the plurality of light-emitting diodes, and covering the wavelength converting layer.

11. The light-emitting device of claim 10 , wherein the wavelength converting layer has a plurality of portions covered by the first insulating material and not covered by the plurality of light-emitting diodes.

12. The light-emitting device of claim 10 , further comprising an electrically conductive structure electrically connected to the plurality of light-emitting diodes.

13. The light-emitting device of claim 10 , further comprising a second insulating material arranged over the electrically conductive structure and the plurality of light-emitting diodes.

14. The light-emitting device of claim 10 , wherein the transparent substrate comprises an insulating oxide material or ceramic material.

15. The light-emitting device of claim 10 , wherein the transparent substrate has a thermal conductivity coefficient ranged from 2 to 200 W/m·K.

16. The light-emitting device of claim 1 , wherein the transparent substrate is constructed as a single layer structure.

17. The light-emitting device of claim 10 , wherein the plurality of light-emitting diodes has a top surface higher than the upper surface.

Assignments (2)
CHANGE OF NAME Recorded Feb 26, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075152/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 7, 2015
From: HAN, CHENG-NAN; RENN, YIH-HUA
To: EPISTAR CORPORATION
Reel/Frame 035350/0572 →