Wireless bus for intra-chip and inter-chip communication, including wireless-enabled component (WEC) embodiments
View Patent ↗Embodiments of the present invention are directed to a wireless-enabled component (WEC) for enabling a wireless bus for intra-chip and inter-chip communication. A WEC encompasses a functional block of an IC (such as, for example, a processing core of a processing unit), an entire IC (such as, for example, a processing unit), or a device that includes a plurality of ICs (such as, for example, a handheld device). According to embodiments, a WEC may be associated with one or more sub-blocks of an IC, a single IC, or a plurality of ICs.
1. A wireless-enabled component (WEC) integrated at least in part on a chip enclosed in a package, comprising:
a core module configured to perform one or more functions of the WEC; and
a wireless transceiver coupled via an interface to the core module and configured to wirelessly communicate, using a signal line in the package, over a wireless to search for a server, upload information to the server, and download a linking resource from the server,
wherein the information relates to the one or more functions of the WEC that the core module is configured to perform or resources of a second WEC that the WEC is looking to couple with, and
wherein the signal line is configured to wirelessly communicate with the second WEC over the wireless bus by wirelessly routing signals out of the package via a non-ohmic coupling to one of a substrate of the package or a printed circuit board.
2. The WEC of claim 1 , wherein the linking resource enables the WEC to link to the second WEC.
3. The WEC of claim 2 , wherein the linking resource identifies the second WEC or defines a type of link to be used to couple the WEC with the second WEC.
4. The WEC of claim 1 , wherein the second WEC is part of a system of WECs that have been dynamically coupled together while the system continued to operate.
5. The WEC of claim 1 , wherein the core module comprises one or more of a microprocessor, a microcontroller, a digital signal processor, a programmable logic circuit, memory, an application specific integrated circuit (ASIC), an analog to digital to converter (ADC), a digital to analog converter (DAC), and digital logic circuitry.
6. The WEC of claim 1 , wherein the wireless transceiver includes a free-space RF transceiver.
7. The WEC of claim 1 , further comprising:
a power interface that receives power from an external source and that provides power to the core module and the wireless transceiver.
8. The WEC of claim 7 , wherein the power interface includes a wireless power interface that receives power wirelessly from the external source.
9. The WEC of claim 1 , further comprising:
a demodulator, coupled to the power interface, that demodulates the power received by the power interface to generate configuration information, and that provides the generated configuration information to the wireless transceiver or the core module.
10. The WEC of claim 9 , wherein the power received by the power interface is amplitude modulated to convey the configuration information.
11. A wireless-enabled component (WEC) integrated at least in part on a chip enclosed in a package, comprising:
a core module configured to perform one or more functions of the WEC; and
a wireless transceiver coupled via an interface to the core module and configured to wirelessly communicate, using a signal line in the package, over a wireless bus to search for a server and upload information to the server relating to the one or more functions of the WEC that the core module is configured to perform and resources of a second WEC that the WEC is looking to couple with,
wherein the signal line is configured to wirelessly communicate with the second WEC over the wireless bus by wirelessly routing signals out of the package via a non-ohmic coupling to one of a substrate of the package or a printed circuit board.
12. The WEC of claim 11 , wherein the second WEC is part of a system of WECs that have been dynamically coupled together while the system continued to operate.
13. The WEC of claim 11 , wherein the core module comprises one or more of a microprocessor, a microcontroller, a digital signal processor, a programmable logic circuit, memory, an application specific integrated circuit (ASIC), an analog to digital to converter (ADC), a digital to analog converter (DAC), and digital logic circuitry.
14. The WEC of claim 11 , wherein the wireless transceiver includes a free-space RF transceiver.
15. The WEC of claim 11 , further comprising:
a power interface that receives power from an external source and that provides power to the core module and the wireless transceiver.
16. The WEC of claim 15 , wherein the power interface includes a wireless power interface that receives power wirelessly from the external source.
17. The WEC of claim 15 , further comprising:
a demodulator, coupled to the power interface, that demodulates the power received by the power interface to generate configuration information, and that provides the generated configuration information to the wireless transceiver or the core module.
18. The WEC of claim 17 , wherein the power received by the power interface is amplitude modulated to convey the configuration information.
19. A wireless-enabled component (WEC) integrated at least in part on a chip enclosed in a package, comprising:
a core module configured to perform one or more functions of the WEC; and
a wireless transceiver coupled via an interface to the core module and configured to wirelessly communicate, using a signal line in the package, over a wireless bus to upload information to a server relating to the one or more functions of the WEC that the core module is configured to perform, resources of a second WEC that the WEC is looking to couple with, and download a linking resource from the server,
wherein the second WEC is part of a system of WECs that have been dynamically coupled together while the system continued to operate, and
wherein the signal line is configured to wirelessly communicate with the second WEC over the wireless bus by wirelessly routing signals out of the package via a non-ohmic coupling to one of a substrate of the package or a printed circuit board.
20. The WEC of claim 19 , wherein the linking resource enables the WEC to link to the second WEC.