IP Library Granted Patent US 9,236,546
Granted Patent B2
US 9,236,546 · App. 14/682,258 · Granted Jan 12, 2016

Optoelectronic components

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Quick Facts
Patent No.
US 9,236,546
App. No.
14/682,258
Granted
Jan 12, 2016
Kind
B2
Abstract

An optoelectronic component includes a carrier; a semiconductor chip having an active layer that generates radiation and is arranged on a carrier; a dispersed material including a matrix material and particles embedded therein arranged on the semiconductor chip and/or the carrier at least in regions, and is integral therewith; and a separating edge between the dispersed material and matrix material formed at a chip edge of the semiconductor chip.

Claims (12)

1. An optoelectronic component comprising:

a carrier;

a semiconductor chip having an active layer that generates radiation and is arranged on a carrier;

a dispersed material comprising a matrix material and particles embedded therein arranged on the semiconductor chip and/or the carrier at least in regions, and is integral therewith; and

a separating edge between the dispersed material and matrix material formed at a chip edge of the semiconductor chip.

2. The component according to claim 1 , wherein the matrix material is integral across the separating edge.

3. The component according to claim 1 , wherein matrix material is arranged on a chip surface facing away from the carrier and dispersed material is arranged on a carrier surface.

4. The component according to claim 1 , wherein the particles of the dispersed material are deposited at the chip edge.

5. The component according to claim 1 , wherein the separating edge is formed by a protective layer made of polytetrafluoroethylene which is applied on a surface of the semiconductor chip facing away from the carrier.

6. The component according to claim 2 , wherein matrix material is arranged on a chip surface facing away from the carrier and dispersed material is arranged on a carrier surface.

7. The component according to claim 2 , wherein the particles of the dispersed material are deposited at the chip edge.

8. The component according to claim 3 , wherein the particles of the dispersed material are deposited at the chip edge.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jan 3, 2020
From: OSRAM OPTO SEMICONDUCTORS GMBH
To: OSRAM OLED GMBH
Reel/Frame 051467/0906 →