IP Library Granted Patent US 9,312,463
Granted Patent B2
US 9,312,463 · App. 14/683,912 · Granted Apr 12, 2016

Light-emitting device

Inventor: Chia-Liang Hsu (Hsinchu, TW)
Assignee: EPISTAR CORPORATION
H01L33/62H01L24/24H01L24/82H01L33/20H01L33/36H01L33/385H01L33/483H01L33/32H01L33/486H01L2224/24225H01L2224/24226H01L2224/32225H01L2224/73267H01L2224/92244H01L2224/97H01L2924/12041H01L2924/12042
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Quick Facts
Patent No.
US 9,312,463
App. No.
14/683,912
Granted
Apr 12, 2016
Kind
B2
Abstract

A light-emitting device comprises: a supporting member having a top surface with a first surface area and a bottom surface with a second surface area; a first conductive via having a top surface with a third surface area; a second conductive via separated from the first conductive via and having a top surface with a fourth surface area, wherein the supporting member surrounds the first conductive via and the second conductive via; and a semiconductor structure comprising an active layer on the supporting member; wherein the sum of the third surface area and the fourth surface area is greater than 40% of the first surface area and smaller than the first surface area.

Claims (25)

1. A light-emitting device, comprising:

a supporting member having a top surface with a first surface area and a bottom surface with a second surface area;

a first conductive via having a top surface with a third surface area;

a second conductive via separated from the first conductive via and having a top surface with a fourth surface area, wherein the supporting member surrounds the first conductive via and the second conductive via; and

a semiconductor structure comprising an active layer on the supporting member;

wherein the sum of the third surface area and the fourth surface area is greater than 40% of the first surface area and smaller than the first surface area.

2. The light-emitting device according to claim 1 , wherein the semiconductor structure further comprises a first conductive type semiconductor layer on the active layer and comprises a second conductive type semiconductor layer between the top surface of the supporting member and the active layer, and the second conductive type semiconductor layer electrically connects with the second conductive via.

3. The light-emitting device according to claim 2 , further comprising an electrode and an insulation structure, wherein the electrode is on the first conductive type semiconductor layer, and the insulation structure is between the electrode and the supporting member.

4. The light-emitting device according to claim 3 , further comprising a conductive structure electrically connecting the first conductive type semiconductor layer to the first conductive via.

5. The light-emitting device according to claim 4 , wherein the conductive structure directly contacts the electrode, the insulation structure and the first conductive via.

6. The light-emitting device according to claim 4 , wherein the conductive structure is formed on a sidewall of the active layer.

7. The light-emitting device according to claim 4 , wherein the insulation structure is formed on a sidewall of the active layer.

8. The light-emitting device according to claim 4 , wherein the insulation structure is between the conductive structure and the active layer.

9. The light-emitting device according to claim 3 , wherein the semiconductor structure is between the electrode and the second conductive via.

10. The light-emitting device according to claim 2 , further comprising a conductive structure electrically connecting the first conductive type semiconductor layer to the first conductive via.

11. The light-emitting device according to claim 2 , wherein the first conductive type semiconductor layer is n-type.

12. The light-emitting device according to claim 2 , wherein the second conductive type semiconductor layer aligns with the second conductive via.

13. The light-emitting device according to claim 2 , further comprising a conductive layer between the second conductive type semiconductor layer and the supporting member for electrically connected the second conductive type semiconductor layer to the second conductive via.

14. The light-emitting device according to claim 13 , wherein a transverse width of the conductive layer is substantially the same as a transverse width of the semiconductor structure.

15. The light-emitting device according to claim 1 , wherein the third surface area is different from the fourth surface area.

16. The light-emitting device according to claim 1 , wherein the active layer of the semiconductor structure has a fifth surface area greater than 30% of the first surface area and smaller than the first surface area.

17. The light-emitting device according to claim 1 , wherein the semiconductor structure is separated from a growth substrate on which the semiconductor structure is originally formed such that the light-emitting device is devoid of the growth substrate.

18. The light-emitting device according to claim 1 , further comprising a conductive structure on the supporting member, on a side wall of the semiconductor structure, and electrically connected the semiconductor structure to the first conductive via.

19. The light-emitting device according to claim 1 , wherein the supporting member comprises flexible material.

20. The light-emitting device according to claim 1 , wherein the supporting member has a thickness smaller than 200 μm.

Assignments (2)
CHANGE OF NAME Recorded Apr 22, 2026
From: EPISTAR CORPORATION
To: ENNOSTAR CORPORATION
Reel/Frame 075513/0783 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 16, 2015
From: HSU, CHIA-LIANG
To: EPISTAR CORPORATION
Reel/Frame 035427/0571 →
Continuity (4)
Continuation 13916805 · Jun 13, 2013
Continuation In Part 13174183 · Jun 30, 2011
Continuation 12318552 · Dec 31, 2008
Related Publication 20150214454A1 · Jul 30, 2015