Semiconductor integrated circuit device
In a semiconductor integrated circuit device, a plurality of electrode pads for external connection are arranged in a zigzag pattern. Some electrode pads of the electrode pads of the plurality of I/O cells which are closer to a side of the semiconductor chip, each have an end portion closer to the side of the semiconductor chip, the end portion being set at the same position as that of an end portion of the corresponding I/O cell. A power source-side protective circuit and a ground-side protective circuit against discharge of static electricity are provided with the power source-side protective circuit being closer to the scribe region. A distance between a center position of one of the electrode pads and the ground-side protective circuit of the corresponding I/O cell and a distance between a center position of the other one electrode pad and the ground-side protective circuit of the corresponding I/O cell are both short and are substantially equal between each I/O cell.
1. A semiconductor integrated circuit device, comprising:
a semiconductor chip including an internal circuit and a plurality of I/O cells, wherein:
the plurality of I/O cells are provided on a periphery area of the semiconductor chip,
each of the plurality of I/O cells includes a protective circuit for protecting the internal circuit from discharge of static electricity,
each of the plurality of I/O cells has a corresponding electrode pad connected to the corresponding protective circuit,
electrode pads for the plurality of I/O cells are arranged on a first line, a second line and a third line, the first line being disposed closer to the outermost edge of the semiconductor chip than the second line, and the second line being disposed closer to the outermost edge of the semiconductor chip than the third line, and
side edges of the electrode pads disposed on the first line, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed on a substantially same line as side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor chip.
2. The semiconductor integrated circuit device of claim 1 , wherein the side edges of the electrode pads disposed on the first line, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed on a same line as the side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor circuit.
3. The semiconductor integrated circuit device of claim 1 , wherein the electrode pads for the plurality of I/O cells are arranged in a zigzag pattern between the first line, the second line and the third line.
4. The semiconductor integrated circuit device of claim 1 , wherein each of the electrode pads arranged at least on the first line and the second line overlaps corresponding one of the plurality of I/O cells in plane view.
5. The semiconductor integrated circuit device of claim 1 , wherein:
the protective circuit of each of the plurality of I/O cells includes:
a power source-side protective circuit provided between the corresponding electrode pad and a power source wiring; and
a ground-side protective circuit provided between the corresponding electrode pad and a ground wiring, and
the power source-side protective circuit is positioned closer to the outermost edge of the semiconductor chip than the ground-side protective circuit.
6. The semiconductor integrated circuit device of claim 5 , wherein the power source wiring is positioned closer to the outermost edge of the semiconductor chip than the ground wiring.
7. The semiconductor integrated circuit device of claim 6 , wherein the power source wiring overlaps the power source-side protective circuit in plane view, while the ground wiring overlaps the ground-side protective circuit in plane view.
8. The semiconductor integrated circuit device of claim 5 , wherein a distance between a center position of the ground-side protective circuit and a center position of the electrode pad connected to the ground-side protective circuit is the same between adjacent two of the I/O cells.
9. The semiconductor integrated circuit device of claim 5 , wherein the side edges of the electrode pads disposed on the first line, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed on a same line as the side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor circuit.
10. The semiconductor integrated circuit device of claim 5 , wherein the electrode pads for the plurality of I/O cells are arranged in a zigzag pattern between the first line, the second line and the third line.
11. The semiconductor integrated circuit device of claim 1 , wherein:
the protective circuit of each of the plurality of I/O cells includes:
a power source-side protective circuit provided between the corresponding electrode pad and a power source wiring; and
a ground-side protective circuit provided between the corresponding electrode pad and a ground wiring, and
the ground-side protective circuit is positioned closer to the outermost edge of the semiconductor chip than the power source-side protective circuit.
12. The semiconductor integrated circuit device of claim 11 , wherein the side edges of the electrode pads disposed on the first line, which are parallel to and closest to the outermost edge of the semiconductor chip, are disposed on a same line as the side edges of the plurality of I/O cells, which are parallel to and closest to the outermost edge of the semiconductor circuit.
13. The semiconductor integrated circuit device of claim 11 , wherein the electrode pads for the plurality of I/O cells are arranged in a zigzag pattern between the first line, the second line and the third line.
14. The semiconductor integrated circuit device of claim 11 , wherein the ground wiring is positioned closer to the outermost edge of the semiconductor chip than the power source wiring.
15. The semiconductor integrated circuit device of claim 14 , wherein the power source wiring overlaps the power source-side protective circuit in plane view, while the ground wiring overlaps the ground-side protective circuit in plane view.
16. The semiconductor integrated circuit device of claim 11 , wherein a distance between a center position of the power source-side protective circuit and a center position of the electrode pad connected to the power source-side protective circuit is the same between adjacent two of the I/O cells.