Connectors for making connections between analyte sensors and other devices
Analyte sensor connectors that connect analyte sensors, e.g., conductive members of analyte sensors, to other devices such as sensor electronics units, e.g., sensor control units, are provided. Also provided are systems that include analyte sensors, analyte sensor connectors, and analyte sensor electronics units, as well as methods of establishing and maintaining connections between analyte sensors and analyte sensor electronics units, and methods of analyte monitoring/detection. Also provided are methods of making analyte sensor connectors and systems that include analyte sensor connectors.
1. An electrode arrangement, comprising:
a base substrate;
a first conductive layer having a width (W 1 ) and positioned on the base substrate;
a first dielectric layer positioned over at least a portion of the first conductive layer; and
a second conductive layer having a with (W 2 ) and positioned on the first dielectric layer, wherein W 1 is less than W 2 or W 2 is less than W 1 .
2. The electrode arrangement of claim 1 , wherein when W 1 is less than W 2 the first conductive layer is spaced away from the first and second side edges of the dielectric base substrate.
3. The electrode arrangement of claim 2 , wherein the second conductive layer terminates at a distal end which is spaced back from the distal end of the first conductive layer.
4. The electrode arrangement of claim 1 , wherein when W 2 is less than W 1 the second conductive layer is spaced away from the first and second side edges of the first dielectric cover layer.
5. The electrode arrangement of claim 4 , wherein the second conductive layer terminates at a distal end which is spaced back from the distal end of the first conductive layer.
6. The electrode arrangement of claim 1 , wherein the first and second conductive layers comprise carbon or gold.
7. The electrode arrangement of claim 1 , wherein W 1 is less than W 2 .
8. The electrode arrangement of claim 1 , wherein W 2 is less than W 1 .
9. The electrode arrangement of claim 1 , wherein W 1 is less than the width of the dielectric base substrate, the width of the first dielectric cover layer and the width of the second dielectric cover layer.
10. The electrode arrangement of claim 1 , wherein W 2 is less than the width of the dielectric base substrate, the width of the first dielectric cover layer and the width of the second dielectric cover layer.
11. The electrode arrangement of claim 1 , further comprising a conductive strip positioned in contact with the second conductive layer and having a width that is the same as the width of the dielectric base substrate, the width of the first dielectric cover layer and the width of the second dielectric cover layer.
12. The electrode arrangement of claim 1 , wherein the first conductive layer has a length (L 1 ) and the second conductive layer has a length (L 2 ).
13. The electrode arrangement of claim 11 , wherein the conductive strip has a length that is less than L 1 and L 2 .
14. The electrode arrangement of claim 11 , wherein the conductive strip is positioned orthogonal to the second conductive layer.
15. The electrode arrangement of claim 11 , wherein the conductive strip comprises a material that is different from the second conductive layer.
16. The electrode arrangement of claim 15 , wherein the second conductive material comprises carbon and the conductive strip comprises Ag/AgCl.
17. The electrode arrangement of claim 1 , wherein the first conductive layer comprises one or more sensing elements, the sensing elements comprising an analyte responsive enzyme and a mediator.
18. The electrode arrangement of claim 17 , wherein the mediator comprises an osmium transition metal complex.
19. The electrode arrangement of claim 17 , further comprising a mass transport limiting layer comprising crosslinked polymers containing heterocyclic nitrogen-containing groups.
20. The electrode arrangement of claim 19 , wherein the mass transport limiting layer comprises one or more leveling agents.
21. The electrode arrangement of claim 20 , wherein the leveling agent is polydimethylsiloxane.
22. The electrode arrangement of claim 1 , wherein first dielectric cover has a thickness which is less than that of the base substrate.
23. The electrode arrangement of claim 22 , further comprising a second dielectric layer positioned to cover at least a portion of the second conductive layer, wherein the second dielectric cover layer has a second thickness which is less than that of the dielectric base substrate.