Light-emitting diode having a roughened surface
View Patent ↗A method of manufacturing a light-emitting diode comprises the steps of providing a substrate comprising an upper surface and a bottom surface opposite to the upper surface; providing a semiconductor stack layer on the upper surface, wherein the semiconductor stack layer comprises a first type semiconductor layer having a first surface, a light-emitting layer on the first type semiconductor layer for emitting light, and a second type semiconductor layer on the light-emitting layer; treating the first surface to form a second surface, wherein the second surface is flatter than the first surface; and providing a laser beam through the second surface to cut the substrate.
1. A method of manufacturing a light-emitting diode, comprising the steps of:
providing a substrate comprising an upper surface and a bottom surface opposite to the upper surface;
providing a semiconductor stack on the upper surface, wherein the semiconductor stack comprises a first type semiconductor layer having a first portion and a second portion, a light-emitting layer on the first portion of the first type semiconductor layer for emitting light, and a second type semiconductor layer on the light-emitting layer, wherein the second portion comprises a first surface;
treating the second portion to form a second surface, wherein the second surface is flatter than the first surface; and
providing a laser beam through the second surface to cut the substrate.
2. A method of manufacturing a light-emitting diode according to claim 1 , wherein a damage region is formed in the substrate under the second surface by the laser beam.
3. A method of manufacturing a light-emitting diode according to claim 1 , wherein the laser beam has a wavelength between 350 nm and 1500 nm.
4. A method of manufacturing a light-emitting diode according to claim 1 , wherein the step of treating the second portion to form the second surface further comprises forming a third surface at the same time, wherein the third surface is separated from the second surface by the first surface.
5. A method of manufacturing a light-emitting diode according to claim 4 , further comprising a step of forming a first electrical pad on the third surface.
6. A method of manufacturing a light-emitting diode according to claim 4 , wherein the second type semiconductor layer has a third portion comprising a fourth surface, wherein a distance between the fourth surface and the upper surface is larger than a distance between the second surface and the upper surface.
7. A method of manufacturing a light-emitting diode according to claim 6 , further comprising a step of treating the third portion to form a fifth surface, wherein the fifth surface is flatter than the fourth surface; wherein the second surface, the third surface and the fifth surface are formed at the same time.
8. A method of manufacturing a light-emitting diode according to claim 1 , wherein the laser beam is scattered by the first surface.
9. A method of manufacturing a light-emitting diode according to claim 1 , wherein the second surface is nearer the substrate than the first surface.
10. A light-emitting diode according to claim 1 , wherein the substrate comprises a transparent substrate.
11. A method of manufacturing a light-emitting diode according to claim 1 , further comprising a step of cleaving the semiconductor stack and the substrate through the second surface to form a plurality of light-emitting diodes.
12. A method of manufacturing a light-emitting diode according to claim 11 , wherein each of the plurality of light-emitting diodes has an edge, and the second surface is on the edge.
13. A method of manufacturing a light-emitting diode according to claim 1 , further comprising a step of forming a reflective layer on the bottom surface, wherein the reflective layer has a reflectivity larger than 70% for the laser beam.
14. A method of manufacturing a light-emitting diode according to claim 13 , wherein the reflective layer comprises a metal layer, DBR, or the combination thereof.
15. A method of manufacturing a light-emitting diode according to claim 1 , wherein the light comprises blue light or green light.
16. A method of manufacturing a light-emitting diode according to claim 1 , wherein a second distance between the second surface and the upper surface is smaller than a first distance between the first surface and the upper surface.
17. A method of manufacturing a light-emitting diode according to claim 1 , wherein a distance between the second surface and the first surface is between 2000 Å and 10000 Å.
18. A method of manufacturing a light-emitting diode according to claim 1 , wherein a width of the second surface is in a range of 5 μm and 15 μm.
19. A method of manufacturing a light-emitting diode according to claim 1 , wherein in the step of providing a laser beam through the second surface to cut the substrate, the laser beam focuses in the substrate.