IP Library Granted Patent US 9,695,067
Granted Patent B2
US 9,695,067 · App. 14/695,148 · Granted Jul 4, 2017

Conductive micro-channel structure

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Quick Facts
Patent No.
US 9,695,067
App. No.
14/695,148
Granted
Jul 4, 2017
Kind
B2
Abstract

A conductive micro-channel structure includes a layer having layer edges and an electrode having first and second portions formed in or under the layer. One or more fluid micro-channels are formed in the layer, expose the first portion of the electrode, and extend to a layer edge to form a fluid port. A conductor micro-channel includes a solid conductor in the conductor micro-channel. The solid conductor is electrically conductive, is electrically connected to the second portion of the electrode, and extends from the second portion to a layer edge to form a conductor port.

Claims (27)

1. A conductive micro-channel structure,

comprising:

a layer having layer edges;

an electrode having first and second portions formed in or under the layer;

one or more fluid micro-channels formed in the layer and exposing the first portion of the electrode, the fluid micro-channel extending to a layer edge to form a fluid port; and

a conductor micro-channel including a solid conductor in the conductor micro-channel, the solid conductor electrically conductive, electrically connected to the second portion of the electrode, and extending from the second portion to a layer edge to form a conductor port.

2. The micro-channel electrode structure of claim 1 , wherein the layer has a layer bottom, the fluid micro-channel has a fluid micro-channel bottom forming the bottom of the fluid micro-channel and a fluid micro-channel top forming the top of the fluid micro-channel, and the fluid micro-channel bottom and the electrode micro-channel bottom are substantially the same distance from the layer bottom.

3. The micro-channel electrode structure of claim 1 , wherein the fluid micro-channel and the conductor micro-channel extend to the same layer edge.

4. The micro-channel electrode structure of claim 1 , wherein the solid conductor passes under the fluid micro-channel or under the electrode.

5. The micro-channel electrode structure of claim 1 , wherein the layer has first and second edges, the fluid micro-channel extends to the first edge and the conductor micro-channel extends to the second edge.

6. The micro-channel electrode structure of claim 1 , further including a plurality of electrodes having first and second portions formed in or under the layer, a corresponding plurality of fluid micro-channels formed in the layer, each fluid micro-channel exposing the first portion of an electrode, and a plurality of conductor micro-channels, the conductor micro-channels each including a solid conductor electrically connected to the second portions of the electrodes that extends from the second portion to an edge of the layer.

7. The micro-channel electrode structure of claim 1 , wherein the solid conductors are electrically connected.

8. The micro-channel electrode structure of claim 1 , further including an electrical power source connected to the solid conductor.

9. The micro-channel electrode structure of claim 1 , wherein one conductor micro-channel is electrically connected to the second portions of two or more electrodes.

10. The micro-channel electrode structure of claim 1 , wherein the solid conductor includes a metal.

11. The micro-channel electrode structure of claim 1 , wherein the solid conductor includes a cured conductive ink.

12. The micro-channel electrode structure of claim 1 , wherein the solid conductor includes a plurality of electrically conductive particles.

13. The micro-channel electrode structure of claim 1 , further including a plurality of layers according to claim 1 .

14. The micro-channel electrode structure of claim 13 , wherein the plurality of layers forms a solid having faces that each correspond to a common edge of the layers.

15. The micro-channel electrode structure of claim 13 , wherein the fluid micro-channels in the layers extend to a face and the solid conductors extend to the same face.

16. The micro-channel electrode structure of claim 13 , wherein the fluid micro-channels in the layers extend to a face and the solid conductors extend to a different face.

17. The micro-channel electrode structure of claim 1 , wherein the fluid micro-channels in the layers each extend to an input layer edge and to an output layer edge.

18. The micro-channel electrode structure of claim 1 , wherein the fluid micro-channels are adapted to convey a fluid.

19. The micro-channel electrode structure of claim 1 , wherein at least a portion of the fluid micro-channels are only partially filled with the solid conductor.

20. A three-dimensional micro-channel structure, comprising:

a plurality of layers arranged in a stack, each layer having one or more separate micro-channels having first, second, and third ports spatially aligned in the stack so that the first, second, or third ports each form one or more first, second, or third contiguous areas, respectively, that do not include other ports, and wherein each of the contiguous areas includes at least one port from each of two or more layers in the stack; and

one or more pipes having an open side that each covers only a contiguous area.

Assignments (10)
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056733/0681 →
NOTICE OF SECURITY INTERESTS Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 056984/0001 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0233 →
INTELLECTUAL PROPERTY SECURITY AGREEMENT Recorded Mar 4, 2021
From: EASTMAN KODAK COMPANY
To: ALTER DOMUS (US) LLC
Reel/Frame 056734/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 30, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; PFC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; QUALEX, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 049901/0001 →
RELEASE OF SECURITY INTEREST Recorded Jul 22, 2019
From: JP MORGAN CHASE BANK, N.A., AS ADMINISTRATIVE AGENT
To: QUALEX, INC.; EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC, INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK IMAGING NETWORK, INC.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER PACIFIC MEDIA CORPORATION; PAKON, INC.; KODAK PHILIPPINES, LTD.; NPEC, INC.; CREO MANUFACTURING AMERICA LLC; KODAK AVIATION LEASING LLC
Reel/Frame 050239/0001 →
SECURITY INTEREST Recorded May 14, 2015
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.
To: BARCLAYS BANK PLC, AS ADMINISTRATIVE AGENT
Reel/Frame 035635/0609 →
SECURITY INTEREST Recorded May 14, 2015
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD; NPEC INC.
To: JPMORGAN CHASE BANK, N.A. AS ADMINISTATIVE AGENT
Reel/Frame 035635/0596 →
SECURITY INTEREST Recorded May 14, 2015
From: EASTMAN KODAK COMPANY; FAR EAST DEVELOPMENT LTD.; FPC INC.; KODAK (NEAR EAST), INC.; KODAK AMERICAS, LTD.; KODAK PORTUGUESA LIMITED; KODAK REALTY, INC.; LASER-PACIFIC MEDIA CORPORATION; QUALEX INC.; KODAK PHILIPPINES, LTD.; NPEC INC.
To: BANK OF AMERICA, N.A., AS AGENT
Reel/Frame 035635/0430 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 24, 2015
From: COK, RONALD STEVEN
To: EASTMAN KODAK COMPANY
Reel/Frame 035486/0624 →