Method for fabricating an advanced routable quad flat no-lead package

1. A leadframe assembly for use in fabricating a QFN package, the leadframe assembly comprising

a substrate;

a routing trace comprising a first portion routing trace having a top side and at least one side wall and a second portion routing trace separated from the first portion routing trace, the second portion routing trace located over a die supporting portion of the substrate;

an etch-stop layer comprising a first portion etch-stop layer positioned between a topside of the substrate and an underside of the routing trace and further comprising a second portion etch-stop layer separated by a cavity from the first portion etch-stop layer over the die supporting portion of the substrate, wherein the etch-stop layer is arranged to prevent etching of the underside of the routing trace;

a top plating layer coupled to a topside of the routing trace and sealing the topside of the routing trace;

at least one side plating layer formed on the at least one side wall of the routing trace and sealing the at least one side wall of the routing trace, wherein the first portion etch-stop layer extends beyond the at least one side plating layer in a direction toward the die supporting layer;

the die supporting layer coupled to a topside of the second portion etch-stop layer;

a die coupled to a topside of the die supporting layer; and

a wire spanning a portion of the cavity and configured to electrically couple the top plating layer to the die.

2. A leadframe assembly according to claim 1 , wherein the substrate and the routing trace are made of copper alloy.

3. A leadframe assembly according to claim 2 , wherein the etch-stop layer is made of one of Ni, NiPd and NiPdAu.

4. A leadframe assembly according to claim 1 , wherein the cavity is approximately 20 μm or less.

5. A QFN package comprising:

a leadframe assembly comprising a substrate, a routing trace comprising a first portion routing trace having a top side and at least one side wall and a second portion routing trace separated from the first portion routing trace, the second portion routing trace located over a die supporting portion of the substrate, and an etch-stop layer comprising a first portion etch-stop layer positioned between a topside of the substrate and an underside of the routing trace and further comprising a second portion etch-stop layer separated by a cavity from the first portion etch-stop layer over the die supporting portion of the substrate, wherein the etch-stop layer is arranged to prevent etching of the underside of the routing trace;

a top plating layer coupled to the topside of the routing trace and sealing the topside of the routing trace;

at least one side plating layer formed on the at least one side wall of the routing trace and sealing the at least one side wall of the routing trace, wherein the first portion etch-stop layer extends beyond the at least one side plating layer in a direction toward the die supporting layer;

the die supporting layer coupled to a topside of the second portion etch-stop layer;

a die coupled to a topside of the die supporting layer;

a wire spanning a portion of the cavity and configured to electrically couple the die to the top plating layer of the leadframe assembly; and

molding material bonding the die, the wire and the leadframe assembly together.

6. A QFN package according to claim 5 , wherein the substrate and the routing trace are made of copper alloy.

7. A QFN package according to claim 6 , wherein the etch-stop layer is made of one of Ni, NiPd and NiPdAu.

8. A QFN package according to claim 5 , wherein the molding material is deposited on a topside of the leadframe assembly and extends into the substrate below the etch-stop layer.