Wafer-level packaged optical subassembly and transceiver module having same

1. A method for fabricating an optical subassembly comprising:

fabricating a top layer silicon wafer, the top layer silicon wafer comprising a plurality of individual units of a top layer;

fabricating a base layer silicon wafer, the base layer silicon wafer comprising a plurality of individual units of a base layer;

aligning and bonding the top layer silicon wafer and the base layer silicon wafer thereby forming a first wafer assembly;

assembling a plurality of active optoelectronic elements onto the first wafer assembly;

fabricating a glass wafer;

aligning and bonding the glass wafer to the first wafer assembly thereby forming a second wafer assembly; and

dicing the second wafer assembly into individual optical subassemblies; wherein:

the step of fabricating the top layer silicon wafer comprises etching a primary cavity and a plurality of peripheral cavities on each individual unit of the top layer; and

the active optoelectronic elements are assembled within the primary cavities of the first wafer assembly.

2. The method of claim 1 , wherein the step of fabricating the top layer silicon wafer further comprises wafer thinning, and deposition of an oxide layer for wafer bonding.

3. The method of claim 1 , wherein the step of fabricating of the base layer silicon wafer comprises wafer thinning, etching of through via holes, deposition of an oxide layer for insulation, deposition of metal to fill the via holes, deposition of metal patterns on top and bottom surfaces of the base layer silicon wafer, and surface finishing to enable component bonding.

4. The method of claim 3 , further comprising:

providing a plurality of upper conductive pads on a bottom surface of the primary cavity; and

bonding the plurality of upper conductive pads to the active optoelectronic elements.

5. The method of claim 4 , further comprising:

providing a plurality of lower conductive pads at a lower peripheral surface of the optical subassembly.

6. The method of claim 5 , further comprising:

connecting the via holes to the lower conductive pads respectively; wherein the lower conductive pads are attached with solder balls configured to allow the optical subassembly to be attached to a circuit board.

7. The method of claim 3 , further comprising: attaching solder bumps to a back side of the second wafer assembly.

8. The method of claim 1 , further comprising:

forming a first opening and second openings on the top layer; wherein:

the primary cavity is defined by the first opening of the top layer, a bottom surface plane of the glass wafer and a top surface plane of the base layer; and

the plurality of peripheral cavities are defined by the second openings of the top layer and the top surface plane of the base layer which are around the at least one primary cavity.

9. The method of claim 8 , further comprising:

forming a plurality of third openings on the glass wafer; wherein each of the third openings is aligned with one of the peripheral cavities as alignment features for external opto-mechanical parts.

10. The method of claim 9 , wherein the size of each third opening is larger than that of the peripheral cavity aligned with the third opening.

11. The method of claim 1 , wherein the active optoelectronic elements comprise laser diodes or photo detectors, in either a singlet form or an array form.

12. The method of claim 1 , further comprising:

providing a plurality of upper conductive pads on a bottom surface of the primary cavity; and

bonding the plurality of upper conductive pads to the active optoelectronic elements.

13. The method of claim 12 , further comprising:

providing a plurality of lower conductive pads at a lower peripheral surface of the optical subassembly.

14. The method of claim 1 , further comprising:

defining a plurality of optical elements on the glass wafer;

aligning the optical elements with the active optoelectronic elements; and

configuring the optical elements to facilitate coupling of optical signals between the active optoelectronic elements and external fibers.

15. The method of claim 1 , wherein the projection of the primary cavity on the top layer has a squared shape, and the projections of the peripheral cavities on the top layer have a circular shape.

16. The method of claim 1 , wherein side walls of the primary cavity and the peripheral cavities are not perpendicular to a surface plane of the glass wafer.

17. The method of claim 1 , further comprising:

bonding a flip-chip to a back side of the base layer;

depositing a plurality of solder bumps at the back side of the base layer; and

electrically connecting the solder bumps to the flip-chip.