Negative photosensitive resin composition, cured resin film, partition walls and optical element
View Patent ↗To provide a negative photosensitive resin composition which may be sufficiently cured even at a low exposure amount and which can impart good ink repellency to the upper surface of partition walls, a cured resin film and partition walls which have good ink repellency on the upper surface, and an optical element which has dots formed with good precision, having opening sections partitioned by partition walls uniformly coated with an ink. A negative photosensitive resin composition comprising an alkali-soluble resin or alkali-soluble monomer (A) having an ethylenic double bond, a photopolymerization initiator (B), a thiol compound (C) having at least 3 mercapto groups in one molecule, and an ink repellent agent (D), a cured resin film and partition walls formed by using the negative photosensitive resin composition, and an optical element having the partition walls located between a plurality of dots and their adjacent dots on a substrate surface.
1. A negative photosensitive resin composition comprising:
an alkali-soluble resin or alkali-soluble monomer (A) having an ethylenic double bond;
a photopolymerization initiator (B);
a thiol compound (C) having at least 3 mercapto groups in one molecule; and
an ink repellent agent (D) which is a compound having an ethylenic double bond.
2. The negative photosensitive resin composition according to claim 1 , wherein, in the total solid content in the negative photosensitive resin composition, the content of the alkali-soluble resin or alkali-soluble monomer (A) is from 5 to 80 mass %, the content of the photopolymerization initiator (B) is from 0.1 to 50 mass %, and the content of the ink repellent agent (D) is from 0.01 to 15 mass %.
3. The negative photosensitive resin composition according to claim 1 , wherein the negative photosensitive resin composition comprises the thiol compound (C) so that the amount of the mercapto groups in the thiol compound (C) is from 0.0001 to 1 mol per 1 mol of the ethylenic double bond in the total solid content in the negative photosensitive resin composition.
4. The negative photosensitive resin composition according to claim 1 , wherein the ink repellent agent (D) has fluorine atoms, and the content of fluorine atoms in the ink repellent agent (D) is from 1 to 40 mass %.
5. The negative photosensitive resin composition according to claim 1 , further comprising a cross-linking agent (E) having at least 2 ethylenic double bonds in one molecule and having no acidic group.
6. The negative photosensitive resin composition according to claim 1 , further comprising a solvent (F).
7. A cured resin film formed from the negative photosensitive resin composition as defined in claim 1 .
8. The cured resin film according to claim 7 , wherein the cured resin film is formed on a substrate and
in a composition analysis in the thickness direction of the cured resin film by X-ray photoelectron spectroscopy (XPS) using Ar sputtering ions,
the ratio of the concentration of fluorine atoms to the concentration of carbon atoms at the surface of the cured resin film is from 0.100 to 3.000, and higher than the average ratio of the concentration of fluorine atoms to the concentration of carbon atoms in a superficial interior region beginning at a position of thickness of 4 nm from the surface of the cured resin film and extending to a position of thickness of 7 nm from the surface,
the ratio of the concentration of sulfur atoms to the concentration of carbon atoms at the surface of the cured resin film is from 0.001 to 0.050, and
the average ratio of the concentration of sulfur atoms to the concentration of carbon atoms in the superficial interior region of the cured resin film is from 0.001 to 0.050.
9. Partition walls, which are made of the cured resin film as defined in claim 7 , wherein the partition walls are formed such that a substrate surface is partitioned into a plurality of compartments.
10. An optical element comprising the partition walls as defined in claim 9 , wherein the partition walls are located between a plurality of dots.
11. The optical element according to claim 10 , wherein the dots are formed by an ink jet method.
12. A negative photosensitive resin composition comprising:
an alkali-soluble resin or alkali-soluble monomer (A) having an ethylenic double bond;
a photopolymerization initiator (B);
a thiol compound (C) having at least 3 mercapto groups in one molecule; and
an ink repellent agent (D), which is a partially hydrolyzed condensate of a hydrolysable silane compound.
13. The negative photosensitive resin composition according to claim 12 , wherein the partially hydrolyzed condensate is a partially hydrolyzed condensate of a hydrolysable silane compound mixture comprising a hydrolysable silane compound (s1) having a fluoroalkylene group and/or a fluoroalkyl group and having a hydrolysable group.
14. The negative photosensitive resin composition according to claim 13 , wherein the hydrolysable silane compound mixture further comprises a hydrolysable silane compound (s2) having 4 hydrolysable groups bonded to the silicon atom.
15. The negative photosensitive resin composition according to claim 14 , wherein the hydrolysable silane compound mixture further comprises a hydrolysable silane compound (s3) having a group with an ethylenic double bond and a hydrolysable group and having no fluorine atom.
16. The negative photosensitive resin composition according to claim 12 , wherein, in the total solid content in the negative photosensitive resin composition, the content of the alkali-soluble resin or alkali-soluble monomer (A) is from 5 to 80 mass %, the content of the photopolymerization initiator (B) is from 0.1 to 50 mass %, and the content of the ink repellent agent (D) is from 0.01 to 15 mass %.
17. The negative photosensitive resin composition according to claim 12 , wherein the negative photosensitive resin composition comprises the thiol compound (C) so that the amount of the mercapto groups in the thiol compound (C) is from 0.0001 to 1 mol per 1 mol of the ethylenic double bond in the total solid content in the negative photosensitive resin composition.
18. The negative photosensitive resin composition according to claim 12 , wherein the ink repellent agent (D) has fluorine atoms, and the content of fluorine atoms in the ink repellent agent (D) is from 1 to 40 mass %.
19. A cured resin film formed from the negative photosensitive resin composition as defined in claim 12 .
20. The cured resin film according to claim 19 , wherein the cured resin film is formed on a substrate and
in a composition analysis in the thickness direction of the cured resin film by X-ray photoelectron spectroscopy (XPS) using Ar sputtering ions,
the ratio of the concentration of fluorine atoms to the concentration of carbon atoms at the surface of the cured resin film is from 0.100 to 3.000, and higher than the average ratio of the concentration of fluorine atoms to the concentration of carbon atoms in a superficial interior region beginning at a position of thickness of 4 nm from the surface of the cured resin film and extending to a position of thickness of 7 nm from the surface, and
the ratio of the concentration of sulfur atoms to the concentration of carbon atoms at the surface of the cured resin film is from 0.001 to 0.050, and
the average ratio of the concentration of sulfur atoms to the concentration of carbon atoms in the superficial interior region of the cured resin film is from 0.001 to 0.050.