IP Library Granted Patent US 9,649,748
Granted Patent B2
US 9,649,748 · App. 14/705,172 · Granted May 16, 2017

Polycrystalline diamond compact with a modified substrate

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Quick Facts
Patent No.
US 9,649,748
App. No.
14/705,172
Granted
May 16, 2017
Kind
B2
Abstract

A superabrasive compact and a method of making the superabrasive compact are disclosed. A method of making a superabrasive compact may comprise steps of treating a substrate to remove a first binder material from a portion of the substrate; introducing a first material into the portion of the substrate, forming a first modified substrate; and treating the porting of modified substrate to remove at least a part of the first material to form a second modified substrate.

Claims (41)

1. A method of making a superabrasive compact, comprising:

treating a substrate to remove a first binder material from a portion of the substrate to form a first region depleted of binder material;

introducing a second material into the first region depleted of binder material, forming a first modified substrate; and

treating the first modified substrate to remove at least a portion of the second material from the first region to form a second region depleted of second material, forming a second modified substrate.

2. The method of the claim 1 , further comprising providing an at least partially leached polycrystalline diamond table near the second modified substrate.

3. The method of the claim 2 , further comprising subjecting the second modified substrate and the at least partially leached polycrystalline diamond table to conditions of an elevated temperature and pressure suitable for producing the polycrystalline superabrasive compact.

4. The method of the claim 1 , wherein the second material is a second binder material.

5. The method of the claim 1 , wherein the first binder material comprises a metal.

6. The method of the claim 1 , wherein the second material is a braze alloy.

7. The method of the claim 1 , wherein the second material is a silicon-containing material.

8. The method of the claim 1 , wherein the second material is an aluminum-containing material.

9. A method of making a superabrasive compact, comprising:

treating a substrate to remove a binder material from a portion of the substrate to form a first region depleted of binder material;

introducing a first material into at least a first part of the first region depleted of binder material, forming a first modified substrate;

providing an at least partially leached polycrystalline diamond table near the first modified substrate; and

subjecting the first modified substrate and the at least partially leached polycrystalline diamond table to conditions of an elevated temperature and pressure suitable for producing the polycrystalline superabrasive compact,

wherein the first material includes at least one of a silicon-containing material and an aluminum-containing material.

10. The method of the claim 9 , further comprising introducing a second material into at least a second part of the first region depleted of binder material.

11. The method of the claim 9 , wherein the binder material comprises a metal selected from the group consisting of Co, Ni, Fe, and combinations thereof.

12. The method of the claim 9 , wherein the first material is a silicon-containing material.

13. The method of the claim 9 , further comprising infiltrating the first material from the first modified substrate into a first region of the at least partially leached polycrystalline diamond table.

14. The method of the claim 9 , further comprising infiltrating the binder material from the first modified substrate into a second region of the at least partially leached polycrystalline diamond table.

15. The method of the claim 13 , wherein the first region occupies from about 20% to up to about 95% volume of the at least partially leached polycrystalline diamond table.

16. The method of the claim 9 , wherein the first material is an aluminum-containing material.

17. The method of the claim 9 , wherein the first material is a braze alloy.

18. The method of the claim 13 , further comprising forming a carbide material between the first material and the diamond when the first material infiltrates into the first region of the at least partially leached polycrystalline diamond table.

19. A method of making a superabrasive compact, comprising:

treating a substrate to remove a first binder material from a first portion of the substrate;

introducing a first material into at least a first part of the first portion of the substrate, forming a first modified substrate;

introducing a second material into at least a second part of the first portion of the substrate, forming a second modified substrate;

providing a diamond volume adjacent to the substrate;

subjecting the substrate and the diamond volume to conditions of an elevated temperature and pressure suitable for producing the polycrystalline superabrasive compact; and

reinfiltrating the diamond volume with the second material followed by infiltrating the first material from the substrate.

20. The method of the claim 19 , wherein the diamond volume is a plurality of diamond powder.

21. The method of the claim 19 , wherein the diamond volume is a thermally stable polycrystalline diamond.

22. The method of the claim 19 , wherein the first binder material comprises a metal selected from the group consisting of Co, Ni, Fe, and combinations thereof.

23. The method of the claim 19 , further comprising reinfiltrating a third material into at least a third part of the first portion of the substrate, forming a third modified substrate before providing the diamond volume adjacent to the substrate.

24. The method of the claim 23 , further comprising reinfiltrating a fourth material into at least a fourth part of the first portion of the substrate, forming a fourth modified substrate before providing the diamond volume adjacent to the substrate.

25. The method of the claim 24 , wherein the fourth material is a binder material.

26. The method of the claim 23 , wherein the third material is a second binder material.

27. The method of the claim 25 , further comprising lapping off a part of the diamond volume.

Assignments (6)
SECURITY INTEREST Recorded Aug 31, 2021
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 057388/0971 →
2L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057650/0602 →
1L PATENT SECURITY RELEASE AGREEMENT Recorded Aug 31, 2021
From: UBS AG, STAMFORD BRANCH
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 057651/0040 →
FIRST LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0415 →
SECOND LIEN PATENT SECURITY AGREEMENT Recorded Sep 4, 2019
From: DIAMOND INNOVATIONS, INC.
To: UBS AG, STAMFORD BRANCH
Reel/Frame 050272/0472 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 6, 2015
From: KONOVALOV, VALERIY; SURYAVANSHI, ABHIJIT PRABHAKAR
To: DIAMOND INNOVATIONS, INC.
Reel/Frame 035576/0375 →