Polycrystalline diamond cutting elements having lead or lead alloy additions

1. A cutting element, comprising:

a substrate comprising a metal carbide; and

a polycrystalline diamond body bonded to the substrate, the polycrystalline diamond body comprising a plurality of diamond grains bonded to adjacent diamond grains by diamond-to-diamond bonds and a plurality of interstitial regions positioned between adjacent diamond grains,

wherein at least a portion of the plurality of interstitial regions comprise lead or lead alloy wherein lead is present in an amount of at least about 90 wt. % of the lead alloy,

wherein the lead or lead alloy comprises of 0.1 vol. % to about 5.0 vol. % of the diamond body, and

wherein at least a portion of the plurality of interstitial regions comprise lead or lead alloy that coat portions of the adjacent diamond grains such that the lead or lead alloy reduces contact between the diamond and a catalyst material.

2. The cutting element of claim 1 , wherein at least a portion of the plurality of interstitial regions are substantially free of lead or lead alloy and catalyst material.

3. The cutting element of claim 2 , wherein the portion of the plurality of interstitial regions that are substantially free of lead or lead alloy and catalyst material are subject to a leaching process.

4. The cutting element of claim 1 , wherein portions of the catalyst material that is positioned within the interstitial regions are spaced apart from the diamond grains by the lead or lead alloy.

5. The cutting element of claim 1 , wherein the diamond grains have higher wettability with the catalyst material than the lead or lead alloy when both are molten.

6. The cutting element of claim 1 , wherein when the lead or lead alloy and the catalyst material are held at a temperature above the melting or liquidus temperature of the catalyst material, the lead or lead alloy has a lower viscosity than the catalyst material.

7. A polycrystalline diamond volume comprising:

a plurality of diamond grains bonded to adjacent diamond grains by diamond-to-diamond bonds forming a continuous diamond matrix and a plurality of interstitial regions positioned between adjacent diamond grains and forming a continuous interstitial matrix,

wherein at least a portion of the continuous interstitial matrix comprises catalyst material comprises a range of from about 4.5 vol. % to about 6.0 vol. % of the diamond body, said catalyst material is separated from the diamond grains by lead or lead alloy wherein lead is present in an amount of at least about 90 wt. % of the lead alloy and wherein the lead or lead alloy comprises 0.33 vol. % to about 1.5 vol. % of the diamond body, such that the lead or lead alloy reduces contact between the diamond and the catalyst material.

8. The cutting element of claim 7 , wherein at least a portion of the plurality of interstitial regions are substantially free of lead or lead alloy and the catalyst material.

9. The cutting element of claim 8 , wherein the portion of the plurality of interstitial regions that are substantially free of lead or lead alloy and catalyst material were subjected to a leaching process.

10. The cutting element of claim 7 , wherein the diamond grains have higher wettability with the catalyst material than the lead or lead alloy when both are molten.

11. A cutting element comprising:

a substrate comprising a metal carbide; and

a polycrystalline diamond body bonded to the substrate, the polycrystalline diamond body comprising a plurality of diamond grains bonded to adjacent diamond grains by diamond-to-diamond bonds forming a continuous diamond matrix and a plurality of interstitial regions positioned between adjacent diamond grains and forming a continuous interstitial matrix,

wherein at least a portion of the continuous interstitial matrix comprises catalyst material wherein the catalyst material comprises a range of from about 0.1 vol. % to about 30.0 vol. % of the diamond body, the catalyst material is separated from the diamond grains by lead or lead alloy wherein lead is present in an amount of at least about 90 wt. % of the lead alloy and wherein the lead or lead alloy comprises of 0.1 vol. % to about 5.0 vol. % of the diamond body such that the lead or lead alloy reduces contact between the diamond and the catalyst material.

12. The cutting element of claim 11 , wherein at least a portion of the plurality of interstitial regions are substantially free of lead or lead alloy and catalyst material.

13. The cutting element of claim 11 , wherein the portion of the plurality of interstitial regions that are substantially free of lead or lead alloy and catalyst material are subject to a leaching process.

14. The cutting element of claim 11 , wherein portions of the catalyst material that is positioned within the interstitial regions are spaced apart from the diamond grains by the lead or lead alloy.

15. The cutting element of claim 11 , wherein the diamond grains have higher wettability with the catalyst material than the lead or lead alloy when both are molten.

16. A drill bit comprising:

a material removal portion having a plurality of shanks, the material removal portion having an axis of rotation that is relative to a base portion; and

at least one cutting element that is bonded to the material removal portion at one of the plurality of shanks, the cutting elements comprising:

a substrate comprising a metal carbide; and

a polycrystalline diamond body bonded to the substrate, the polycrystalline diamond body comprising a plurality of diamond grains bonded to adjacent diamond grains by diamond-to-diamond bonds and a plurality of interstitial regions positioned between adjacent diamond grains,

wherein at least a portion of the plurality of interstitial regions comprise lead or lead alloy wherein lead is present in an amount of at least about 90 wt. % of the lead alloy wherein the lead or lead alloy comprises 0.33 vol. % to about 1.5 vol. % of the diamond body, and

wherein at least a portion of the plurality of interstitial regions comprise lead or lead alloy that coat portions of the adjacent diamond grains such that the lead or lead alloy reduces contact between the diamond and a catalyst material.

17. The drill bit of claim 16 , wherein at least a portion of the plurality of interstitial regions are substantially free of lead or lead alloy and catalyst material.

18. The drill bit of claim 17 , wherein the portion of the plurality of interstitial regions that are substantially free of lead or lead alloy and catalyst material are subject to a leaching process.

19. The drill bit of claim 16 , wherein portions of the catalyst material that is positioned within the interstitial regions are spaced apart from the diamond grains by the lead or lead alloy.

20. The drill bit of claim 16 , wherein the diamond grains have higher wettability with the catalyst material than the lead or lead alloy when both are molten.

21. A cutting element, comprising:

a substrate comprising a metal carbide; and

a polycrystalline diamond body bonded to the substrate, the polycrystalline diamond body comprising a plurality of diamond grains bonded to adjacent diamond grains by diamond-to-diamond bonds and a plurality of interstitial regions positioned between adjacent diamond grains,

wherein at least a portion of the plurality of interstitial regions comprise lead wherein lead is present in an amount of at least about 90 wt. % of a lead alloy;

wherein the lead alloy comprises of 0.1 vol. % to about 5.0 vol. % of the diamond body, and

wherein at least a portion of the plurality of interstitial regions comprise lead alloy that coats portions of the adjacent diamond grains such that the lead alloy reduces contact between the diamond and the catalyst material.