Wafer prober integrated with full-wafer contacter
View Patent ↗Methods and apparatus for testing unsingulated integrated circuits on a wafer include adapting a wafer prober for use with full-wafer-contacter disposed on the wafer. Some embodiments include placing wafer on a chuck of the prober, aligning the wafer to a full-wafer contacter incorporated in the wafer prober; removably attaching the wafer to the full wafer contacter, separating the wafer from the chuck, and making electrical contact to one or more integrated circuits of the wafer by making physical contact with a surface of the full-wafer contacter that faces away from the wafer.
1. A method for coupling a plurality of electrical pathways to a wafer, comprising:
positioning a wafer-side of a wafer translator to face a wafer, wherein the wafer translator has an inquiry-side facing away from the wafer-side, wherein the wafer translator has a first plurality of first scale contact pads at the wafer-side corresponding to contacts on the wafer, and a second plurality of second scale contact pads at the inquiry-side corresponding to contacts of a probe card, wherein the first scale is generally smaller than the second scale, and wherein the wafer translator is monolithic between the wafer-side and the inquiry-side; and
sealing a space between the wafer translator and the wafer.
2. The method of claim 1 , further comprising connecting a source of vacuum to the space between the wafer translator and the wafer.
3. The method of claim 2 , further comprising applying a vacuum to the space between the wafer translator and the wafer.
4. The method of claim 1 , further comprising:
placing the wafer in contact with the wafer-side of the translator.
5. The method of claim 4 wherein the wafer translator is more rigid than the wafer.
6. The method of claim 4 wherein the wafer is at least partially conformed to the wafer translator.
7. The method of claim 1 wherein the wafer translator is mechanically coupled to a mounting fixture.
8. The method of claim 7 wherein the mounting fixture is removably attached to a top plate attachment.
9. The method of claim 1 wherein sealing a space between the wafer translator and the wafer is performed with a gasket.
10. The method of claim 1 wherein the wafer translator is laterally continuous between the wafer-side and the inquiry-side.
11. A method for coupling a plurality of electrical pathways to a wafer, comprising:
positioning a wafer-side of a wafer translator to face a wafer, wherein the wafer translator has an inquiry-side facing away from the wafer-side, wherein the wafer translator has a first plurality of first scale contact pads at the wafer-side that correspond to contacts on the wafer by having a pattern of the first scale contact pads at the wafer-side that matches a layout of at least a portion of the contacts on the wafer, and a second plurality of second scale contact pads at the inquiry-side that correspond to contacts on a probe card by having a pattern of the second scale contact pads at the inquiry-side that matches a layout of at least a portion of pins on the probe card, wherein the first scale is generally smaller than the second scale, and wherein the wafer translator is monolithic between the wafer-side and the inquiry-side; and
sealing a space between the wafer translator and the wafer.
12. The method of claim 11 further comprising contacting the wafer with the wafer-side of the wafer contactor.
13. The method of claim 11 , further comprising connecting a source of vacuum to the space between the wafer translator and the wafer.
14. The method of claim 11 , further comprising applying a vacuum to the space between the wafer translator and the wafer.
15. The method of claim 14 wherein the wafer at least partially conforms to the shape of the wafer translator.
16. A method for coupling a plurality of electrical pathways to a wafer, comprising:
positioning a wafer-side of a wafer translator to face a wafer, wherein the wafer translator has an inquiry-side facing away from the wafer-side and a circumferential lateral outer surface between the wafer-side and the inquiry-side, wherein the wafer translator has a first plurality of first scale contact pads at the wafer-side corresponding to contacts of the wafer, and a second plurality of second scale contact pads at the inquiry-side corresponding to contacts of a probe card, wherein the first scale is generally smaller than the second scale, wherein the wafer translator is rigid between the wafer-side, the inquiry-side and the entire circumferential lateral outer surface; and
sealing a space between the wafer translator and the wafer.
17. The method of claim 16 further comprising connecting a vacuum source to the space between the wafer translator and the wafer.
18. The method of claim 16 wherein the wafer translator is mechanically coupled to a mounting fixture.
19. The method of claim 16 wherein the wafer translator is an edge extended wafer translator extending outside a circumferential edge of the wafer.
20. The method of claim 16 , further comprising:
positioning the wafer to contact the wafer-side of the translator, wherein the wafer translator is more rigid than the wafer.
21. The method of claim 20 wherein the wafer is at least partially conformed to the wafer translator.
22. The method of claim 16 wherein the wafer translator is laterally continuous between the wafer-side and the inquiry-side.