Adhesive composition and endoscope device

1. An adhesive composition comprising:

a main agent comprising an acrylic rubber and an epoxy resin, wherein the epoxy resin is selected from the group consisting of a bisphenol A epoxy resin, a bisphenol F epoxy resin, and a phenol novolac epoxy resin, and combinations thereof;

a curing agent containing xylylene diamine;

a filler containing silica; and

an organic ion exchanger comprising at least one of styrene, divinyl benzene, and derivatives thereof.

2. The adhesive composition according to claim 1 , wherein the organic ion exchanger is contained in a content of 0.8 to 12 parts by mass based on 100 parts by mass of the main agent.

3. An endoscope device comprising at least two constituent members bonded to each other through an adhesive layer obtained by curing an adhesive composition according to claim 1 .

4. An endoscope device comprising at least two constituent members bonded to each other through an adhesive layer obtained by curing an adhesive composition according to claim 2 .

5. The adhesive composition according to claim 1 , wherein the acrylic rubber has an average particle size of 300 nm or less.

6. The adhesive composition according to claim 1 , wherein the acrylic rubber is contained in a content of about 1 to 20 parts by mass based on 100 parts by mass of the main agent.

7. The adhesive composition according to claim 1 , wherein the acrylic rubber is contained in a content of about 5 to 15 parts by mass based on 100 parts by mass of the main agent.

8. The adhesive composition according to claim 1 , wherein the epoxy resin is selected from the group consisting of bisphenol A epoxy resin, bisphenol F epoxy resin, and phenol novolac epoxy resin.

9. The adhesive composition according to claim 1 , wherein the bisphenol A epoxy resin is contained in a content of about 20 to 70 parts by weight, based on 100 parts by mass of the main agent.

10. The adhesive composition according to claim 1 , wherein the bisphenol A epoxy resin is contained in a content of 30 to 60 parts by weight, based on 100 parts by mass of the main agent.

11. The adhesive composition according to claim 1 , wherein the bisphenol F epoxy resin is contained in a content of about 10 to 60 parts by weight, based on 100 parts by mass of the main agent.

12. The adhesive composition according to claim 1 , wherein the bisphenol F epoxy resin is contained in a content of about 30 to 60 parts by weight, based on 100 parts by mass of the main agent.

13. The adhesive composition according to claim 1 , wherein the phenol novolac epoxy resin is contained in a content of about 20 to 40 parts by weight, based on 100 parts by mass of the main agent.

14. The adhesive composition according to claim 1 , wherein the phenol novolac epoxy resin is contained in a content of about 30 parts by weight, based on 100 parts by mass of the main agent.

15. The adhesive composition according to claim 1 , wherein the xylylene diamine is contained in a content of about 10 to 99% by mass of the total amount of the curing agent.

16. The adhesive composition according to claim 1 , wherein the xylylene diamine is contained in a content of about 30 to 97% by mass of the total amount of the curing agent.

17. The adhesive composition according to claim 1 , wherein the curing agent further comprises a derivative of xylylene diamine.

18. The adhesive composition according to claim 17 , wherein the derivative of xylylene diamine is selected from the group consisting of alkylene oxide adducts, glycidyl ester adducts, glycidyl ether adducts, Mannich adducts, acrylonitrile adducts, epichlorohydrin adducts and xylylene diamine trimer.

19. The adhesive composition according to claim 1 , wherein the silica is spherical silica of an average particle size of 4 μm to 7 μm.

20. The adhesive composition according to claim 1 , wherein the silica is contained in a content of 20 to 40 parts by mass, based on 100 parts by mass of the adhesive main agent.