Electrical components and methods and systems of manufacturing electrical components
A method of manufacturing an electrical component includes providing an electrically insulating substrate having an outer surface, applying a coated structure on the outer surface and irradiating the coated structure with an electron beam to form an electrical conductor on the substrate. The irradiating may include heating the coating layer to melt the coating layer to form the electrical conductor. The coating layer may have a low binder concentration and a high metal concentration. The irradiating may include vaporizing substantially all the binder leaving a substantially pure metallic layer to form the electrical conductor. The coating layer may be irradiated until non-metallic material of the coating layer is completely removed.
1. A method of manufacturing an electrical component, the method comprising:
providing an electrically insulating substrate having an outer surface;
applying a coating layer, including metallic material and non-metallic material, on the outer surface by selectively printing the coating layer in a circuit pattern on the outer surface, the coating layer having an interior volume defined between an inner surface of the coating layer on the outer surface of the substrate and an outer surface of the coating layer opposite the inner surface of the coating layer; and
irradiating the entire coating layer with an electron beam at a beam focus spot in the interior volume remote from the inner surface of the coating layer and remote from the outer surface of the coating layer at a depth of between ⅓ and ⅔ of a depth of the coating layer, said irradiating causes electrons of the electron beam to interact with the metallic material and the non-metallic material in the interior volume of the coating layer to change the chemical structures of the metallic material and the non-metallic material of the coating layer in the interior volume of the coating layer until the non-metallic material of the coating layer is completely removed to form an electrical conductor devoid of the non-metallic material on the substrate.
2. The method of claim 1 , wherein said irradiating comprises transmitting the electron beam such that electrons of the electron beam at least partially penetrate the coating layer.
3. The method of claim 1 , said irradiating the coating layer comprises using non-adiabatic electron beam processing.
4. The method of claim 1 , wherein said irradiating the coating layer comprises heating the coating layer to melt the coating layer to form the electrical conductor.
5. The method of claim 1 , wherein the coating layer includes metal precursors, said irradiating the coating layer comprises irradiating the coating layer to chemically reduce the metal precursors to metals to form the electrical conductor.
6. The method of claim 1 , further comprising preheating the coating layer to a temperature below a melting point of the coating layer during a preheating process, said irradiating the coating layer comprises heating the preheated coating layer to a temperature above the melting point of the coating layer.
7. The method of claim 1 , wherein said applying a coating layer comprises applying a coating layer having a combination of binder and metal concentrations, said irradiating the coating layer comprises vaporizing the binder leaving a metallic layer to form the electrical conductor.
8. The method of claim 1 , wherein said applying a coating layer comprises applying a coating layer having a metal precursor, said irradiating the coating layer comprises reacting the metal precursors with the electrons of the electron beam to transform the coating layer into a conductive structure.
9. The method of claim 1 , wherein said irradiating the coating layer comprises irradiating different portions of the coating layer differently to form a resistor in the electrical conductor.
10. The method of claim 1 , wherein said irradiating the coating layer comprises controlling operating parameters of the electron beam based on the properties of the coating layer.
11. The method of claim 1 , wherein said applying a coating layer comprises printing the coating layer directly on the outer surface of the substrate.
12. The method of claim 1 , further comprising electrically grounding the coating layer during the irradiating process.
13. The method of claim 1 , wherein said irradiating the coating layer comprises controlling energy density of the electron beam during processing.
14. The method of claim 1 , wherein said irradiating the coating layer comprises controlling deflection speed of electrons of the electron beam during processing.
15. The method of claim 1 , wherein said irradiating the coating layer comprises controlling maximum acceleration voltage of electrons of the electron beam during processing.
16. The method of claim 1 , wherein said irradiating the coating layer comprises controlling maximum electron beam current of electrons of the electron beam during processing.
17. The method of claim 1 , wherein said irradiating the coating layer comprises controlling an electron beam focus spot size and an electron beam focus depth within the coating layer during processing.
18. The method of claim 1 , wherein said irradiating the coating layer comprises uniformly heating the interior volume of the coating layer.
19. The method of claim 6 , wherein said preheating the coating layer comprises irradiating the coating layer with an electron beam to a preheated temperature below the melting point of the coating layer.