IP Library Granted Patent US 10,175,227
Granted Patent B2
US 10,175,227 · App. 14/717,833 · Granted Jan 8, 2019

Gas sensor module

Inventors: Steven A. Rodriguez (Seattle, WA); Stephen M. Bailey (Shoreline, WA); David A. Herrin (Seattle, WA); Gordon W. Lam (Renton, WA)
Assignee: GM NAMEPLATE, INC.
G01N33/497A61B5/082A61B5/097G01N2033/4975
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 10,175,227
App. No.
14/717,833
Granted
Jan 8, 2019
Kind
B2
Abstract

A sensor module includes a substrate with a slot formed therein. A sensor is mounted to the substrate and spans the slot. A first cover is disposed on a first side of the substrate and covers at least a portion of the slot. The first cover comprises a first aperture and a second aperture in fluid communication with the slot. The sensor is disposed between the first and second apertures.

Claims (11)

1. A sensor module configured to be detachably mounted to a mount of a sensing device, the sensor module comprising:

(a) a substrate having a slot formed therein, the substrate comprising an edge connector formed on an edge of the substrate, the edge connector being configured to detachably couple the substrate to the mount of the sensing device;

(b) a sensor mounted to the substrate and spanning the slot; and

(c) a first cover disposed on a first side of the substrate and covering at least a portion of the slot, the first cover comprising a first aperture and a second aperture in fluid communication with the slot, wherein the sensor is disposed between the first and second apertures.

2. The sensor module of claim 1 , wherein the slot extends only partially through the substrate from the first side of the substrate.

3. The sensor module of claim 1 , wherein at least a portion of the slot extends through a second side of the substrate.

4. The sensor module of claim 3 , further comprising a second cover disposed on the second side of the substrate, the second cover covering the slot.

5. The sensor module of claim 1 , wherein the sensor is disposed under a dimple formed in the first cover.

6. The sensor module of claim 1 , wherein the sensor is an acetone sensor.

7. The sensor module of claim 1 , wherein the sensor comprises WO 3 .

8. The sensor module of claim 1 , wherein the substrate is a printed circuit board.

Assignments (3)
RELEASE OF SECURITY INTEREST Recorded Mar 13, 2026
From: ROYAL BANK OF CANADA, AS FIRST LIEN AGENT
To: BOYD GMN, INC.
Reel/Frame 074065/0735 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 25, 2021
From: GM NAMEPLATE, INC.
To: MEDAMONITOR, LLC
Reel/Frame 056348/0589 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 21, 2015
From: RODRIGUEZ, STEVEN A.; BAILEY, STEPHEN M.; HERRIN, DAVID A.; LAM, GORDON W.
To: GM NAMEPLATE, INC.
Reel/Frame 035687/0960 →
Continuity (1)
Related Publication 20160341715A1 · Nov 24, 2016