IP Library Granted Patent US 9,635,753
Granted Patent B2
US 9,635,753 · App. 14/723,604 · Granted Apr 25, 2017

Wiring board

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Quick Facts
Patent No.
US 9,635,753
App. No.
14/723,604
Granted
Apr 25, 2017
Kind
B2
Abstract

A wiring board in the present invention includes an insulating layer, a via-hole penetrating from an upper surface to a lower surface of the insulating layer, a wiring formation layer, and a grounding or power supply conductor, in which the wiring formation layer is formed of a plurality of strip-shaped conductors, and an insulating resin portion filled in at least between the strip-shaped conductors, the grounding or power supply conductor is formed to partially face the strip-shaped conductors, and a relative permittivity of the insulating layer is higher than a relative permittivity of the insulating resin portion.

Claims (14)

1. A wiring board comprising:

an insulating layer having a relative permittivity of 4.5 or more;

a via-hole penetrating from an upper surface to a lower surface of the insulating layer to electrically connect the upper surface to the lower surface of the insulating layer;

a wiring formation layer formed on a surface of the insulating layer; and

a grounding or power supply conductor formed on a surface opposite to the surface of the insulating layer on which the wiring formation layer is formed, wherein

the wiring formation layer is formed of a plurality of strip-shaped conductors extending in parallel to each other, and an insulating resin portions filled in at least between the strip-shaped conductors,

the grounding or power supply conductor is formed to partially face the strip-shaped conductors, and

a ratio of the relative permittivity of the insulating layer and a relative permittivity of the insulating resin portion is at least 1.125.

2. The wiring board according to claim 1 , wherein

each of the strip-shaped conductors has a triangular cross-sectional surface taken vertically in an extending direction.

3. The wiring board according to claim 1 , wherein

a difference between the relative permittivity of the insulating layer and the relative permittivity of the insulating resin portion is 0.5 or more.

4. The wiring board according to claim 1 , wherein

the insulating resin portion has the relative permittivity of 2 to 4.

Assignments (2)
CHANGE OF NAME Recorded May 25, 2016
From: KYOCERA CIRCUIT SOLUTIONS, INC.
To: KYOCERA CORPORATION
Reel/Frame 038806/0631 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded May 28, 2015
From: HASEGAWA, YOSHIHIRO
To: KYOCERA CIRCUIT SOLUTIONS, INC.
Reel/Frame 035734/0390 →