Circuit board device and circuit board device for reducing acoustic noise
A circuit board device for reducing acoustic noise is provided. The circuit board device includes a substrate, a first capacitor packaging area, a second capacitor packaging area, a first pad, a second pad, a third pad and a fourth pad. The first and second capacitor packaging areas are respectively disposed on a first side and a second side of the substrate in a back-to-back manner. The first and second pads are disposed in the first capacitor packaging area for mounting a first capacitor. The third and fourth pads are disposed in the second capacitor packaging area for mounting a second capacitor, wherein the first and third pads are set back-to-back and electrically connected to each other, and the second and fourth pads are set back-to-back and electrically connected to each other.
1. A circuit board device for reducing acoustic noise, comprising:
a substrate;
a first capacitor packaging area and a second capacitor packaging area, in a back-to-back manner, disposed on a first side and a second side of the substrate respectively;
a first pad and a second pad disposed in the first capacitor packaging area for mounting a first capacitor;
a third pad and a fourth pad disposed in the second capacitor packaging area for mounting a second capacitor; and
an opening, setting between the first, second, third and fourth pads and passing through the first and second capacitor packaging areas, wherein the first and third pads are set back-to-back and electrically connected to each other; and
wherein the second and fourth pads are set back-to-back and electrically connected to each other.
2. The circuit board device of claim 1 , wherein the first and second capacitors are multilayer ceramic capacitors (MLCC).
3. The circuit board device of claim 1 , wherein the size and capacitance of the first capacitor are the same as the size and capacitance of the second capacitor.
4. A circuit device for reducing acoustic noise, comprising:
a first capacitor ;
a second capacitor;
a circuit board device, comprising:
a substrate;
a first capacitor packaging area and a second capacitor packaging area, in a back-to-back manner, disposed on a first side and a second side of the substrate respectively;
a first pad and a second pad disposed in the first capacitor packaging area for mounting a first capacitor; and
a third pad and a fourth pad disposed in the second capacitor packaging area for mounting a second capacitor; and
an opening, setting between first, second, third and fourth pads, and passing through the first and second capacitor packaging areas, wherein the first and third pads are set back-to-back and electrically connected to each other and the second and fourth pads are set back-to-back and electrically connected to each other;
a driving circuit disposed on the circuit board device;
a load circuit disposed on the circuit board device; and
a conduction path coupled to the driving circuit and the load circuit and electrically connected to the first and third pads.
5. The circuit device of claim 4 , wherein the first and second capacitors are multilayer ceramic capacitors (MLCC).
6. The circuit device of claim 4 , wherein the size and capacitance of the first capacitor are the same as the size and capacitance of the second capacitor.