Exposure device and image formation apparatus having thermally-conductive sealant
View Patent ↗An exposure device includes: a substrate having a first and second surface opposed to each other, wherein a light-emitting element array is mounted on the first surface; a protective sheet covering the second surface while exposing a part of the second surface in the vicinity of an edge of the substrate to define an exposed part of the second surface; a holder that supports a condenser lens array and that supports the substrate, with a gap formed between the holder and the exposed part of the substrate, to position the substrate such that light emitted from the light-emitting element array is condensed on a predetermined irradiation location through the condenser lens array; and a thermally-conductive sealant that covers the exposed part of the second surface of the substrate and seals the gap.
1. An exposure device comprising:
a substrate having a wiring pattern of a wiring member therein and having a first surface and a second surface opposed to the first surface, wherein a light-emitting element array for emitting exposure light is mounted on the first surface;
a protective sheet covering the second surface while leaving at least a part of the second surface exposed in the vicinity of an edge of the substrate to define an exposed part of the second surface;
an attachment member attached to the substrate and pressing the protective sheet to the second surface to thereby fix the protective sheet to the second surface;
a holder that supports a condenser lens array for condensing light, and that supports the attachment member to support the substrate via the attachment member, with a gap formed between the holder and the exposed part of the substrate, to position the substrate such that light emitted from the light-emitting element array is condensed on a predetermined irradiation location through the condenser lens array; and
a thermally-conductive sealant that covers the exposed part of the second surface of the substrate and seals the gap such that the thermally-conductive sealant is in direct contact with both the exposed part and the holder.
2. The exposure device according to claim 1 , wherein
the substrate exposes a part of the wiring member on the second surface,
the attachment member is conductive, and
the protective sheet is insulative.
3. The exposure device according to claim 2 , wherein
the substrate exposes a part of the wiring member on the exposed part of the second surface, and
the sealant is insulative.
4. The exposure device according to claim 1 , wherein
the protective sheet is shaped to define the exposed part of the second surface of the substrate such that a width of the exposed part from the edge of the substrate is greater at a portion away from a location of contact of the protective sheet with the attachment member than at a portion near the location of the contact.
5. The exposure device according to claim 1 , wherein
the substrate is provided with a through-hole, and
the protective sheet is insulative and formed in such a shape as to cover the through-hole.
6. The exposure device according to claim 1 , wherein
the substrate is provided with through-holes, and
the sealant is insulative and covers a through-hole formed in the exposure part of the second surface of the substrate.
7. An image formation apparatus comprising the exposure device according to claim 1 .
8. The exposure device according to claim 1 , wherein
the exposed part is provided at each widthwise side of a protection area of the second surface which is covered with the protective sheet,
the thermally-conductive sealant is provided to cover the exposed part at the each widthwise side of the protection area.
9. The exposure device according to claim 1 , further comprising
a glue provided in the gap between the substrate and the holder and fixing the attachment to the holder, thereby fixing the substrate to the holder via the attachment, wherein
the thermally-conductive sealant seals an area of the gap where the glue have not sealed the gap.
10. A method of manufacturing an exposure device having a substrate having a first surface and a second surface opposed to the first surface, wherein a light-emitting element array for emitting exposure light is mounted on the first surface, the method comprising:
covering the second surface with a protective sheet such except for a part of the second surface in the vicinity of an edge of the substrate, which is defined as an exposed part of the second surface;
attaching an attachment member to the substrate such that the attachment member presses and fixes the protective sheet to the second surface of the substrate;
fixing the attachment member to a holder having a condenser lens array supported, with a gap formed between the holder and the exposed part of the second surface of the substrate, while positioning the substrate such that light emitted from the light-emitting element array is condensed on a predetermined irradiation location through the condenser lens array; and
providing a thermally-conductive sealant such that the sealant covers the exposed part of the second surface of the substrate and seals the gap and thereby the thermally-conductive sealant is in direct contact with both the exposed part and the holder.