Package and method for fabricating package
View Patent ↗A package that hermetically seals an integrated circuit includes a metal lid ( 7 ) and a metal housing ( 10 ) having an open upper portion ( 12 ). In the package, the housing ( 10 ) includes in a wall surface thereof a glass unit ( 2 ) that seals a plurality of lead terminals therein. The glass unit ( 2 ) is disposed in a wall surface of the housing ( 10 ) such that a thickness in a vertical direction of the wall surface on an upper side of the glass unit ( 2 ) is determined according to a threshold limit value of a difference in temperature between glass that forms the glass unit ( 2 ) and metal that forms the wall surface.
1. A package that hermetically seals an integrated circuit, the package comprising:
a metal housing having an open upper portion; and
a metal lid,
wherein the metal housing includes a metal unit and a glass unit configured to hold a plurality of lead terminals in a central section of a front wall of the metal housing,
wherein the glass unit includes lead terminals which are vertically arranged on an upper side of a horizontally extended centerline of the glass unit, and
wherein a thickness in a vertical direction of the metal unit on an upper side of the glass unit is set such that heat capacity of the metal unit is set to a level where stress caused by a difference between a temperature of the glass unit and a temperature of the metal unit would not damage the glass unit when a process for sealing the metal housing and the metal lid is performed.
2. The package according to claim 1 ,
wherein the glass unit has a depth set to match with a length of a portion of the lead terminals, the portion protruding to an inside of the housing.
3. The package according to claim 1 ,
wherein an interface between the wall of the housing and the glass unit is formed to be wavy.
4. The package according to claim 1 ,
wherein columnar shapes are metal columnar shapes, which are provided to increase heat capacity of the metal unit.
5. A method for fabricating a package that hermetically seals an integrated circuit with use of a metal housing having an open upper portion and of a metal lid, the method comprising:
forming a metal housing having an open upper portion and a terminal sealing hole in a central section of a front wall of the metal housing,
forming a preformed glass for holding a plurality of lead terminals,
fitting the preformed glass into the terminal sealing hole, and
firing the metal housing together with the preformed glass to form the housing having a glass unit,
wherein, when forming the preformed glass, vertically arranging lead terminals on an upper side of the horizontally extended centerline of the preformed glass, and
forming the glass unit such that a thickness in a vertical direction of a metal unit on an upper side of the glass unit is set such that heat capacity of the metal unit is set to a level where stress caused by a difference between a temperature of the glass unit and a temperature of the metal unit would not damage the glass unit when a process for sealing the metal housing and the metal lid is performed.
6. The method for fabricating a package according to claim 5 ,
wherein the glass unit has a depth set to match with a length of a portion of the lead terminals, the portion protruding to an inside of the housing.
7. The method for fabricating a package according to claim 5 , wherein, when forming the preformed glass, separately forming an upper preformed glass and a lower preformed glass.
8. The method for fabricating a package according to claim 5 ,
wherein an interface between the wall of the housing and the glass unit is formed to be wavy.