Metal oxide TFT device and method for manufacturing the same
A method for manufacturing a metal oxide TFT device is provided. The method includes: selecting a substrate and forming a gate electrode on a first side of the substrate; sequentially depositing an insulating layer, a semiconductor layer, and a photoresist layer on the gate electrode; using the gate electrode as a photomask, exposing from a second side of the substrate and reserving the photoresist layer aligning to the gate electrode; depositing an electrode layer on the semiconductor layer and the reserved photoresist layer; stripping the reserved photoresist layer and lifting off the electrode layer stacked on the reserved photoresist layer; etching a part of the reserved electrode layer and the semiconductor layer, and forming a source electrode, a drain electrode, and a semiconductor island. The method realizes a self-alignment using the gate electrode as the photomask when forming the source, drain electrodes and the channel. Therefore, the manufacturing processes become simple and more accurate.
1. A method for manufacturing a pixel circuit, comprising:
selecting a substrate and forming a gate, a gate line, and a first storage capacitor electrode on a first side of the substrate;
sequentially depositing an insulating layer, a metal oxide semiconductor layer, and a photoresist layer on the gate electrode, the gate line, the first storage capacitor electrode, and the first side of the substrate;
using the gate electrode, the gate line, and the first storage capacitor electrode as photomasks, exposing from a second side of the substrate that opposes to the first side, and reserving parts of the photoresist layer that align to the gate electrode, the gate line, and the first storage capacitor electrode;
depositing an electrode layer on the metal oxide semiconductor layer and the reserved photoresist layer;
stripping the reserved photoresist layer and lifting off parts of the electrode layer that are stacked on the reserved photoresist layer, so as to expose parts of the metal oxide semiconductor layer that align to the gate electrode, the gate line, and the first storage capacitor electrode, and reserving other parts of the electrode layer; and
etching a part of the reserved electrode layer and the metal oxide semiconductor layer, and forming a source electrode, a drain electrode, and a metal oxide semiconductor island.
2. The method of claim 1 , wherein the step of depositing an electrode layer on the semiconductor layer and the reserved photoresist layer comprises:
depositing an electrode contact layer on the semiconductor layer and the reserved photoresist layer; and
depositing the electrode layer on the electrode contact layer.
3. The method of claim 1 , further comprising:
depositing a passivation layer on the source, drain electrodes, the channel, and the insulating layer, and forming vias through the passivation layer to the source and drain electrodes, and the gate line.
4. The method of claim 3 , further comprising:
depositing a conductive layer on the passivation layer and in the vias, and etching a part of the conductive layer to form a second storage capacitor electrode stacked on the first storage capacitor electrode via the insulating layer and the passivation layer, and form electrical connections respectively connected to the source, drain electrodes, and the gate line.