Method of fabricating a chip module with stiffening frame and directional heat spreader
A method of fabricating a chip module is presented. The chip module includes a stiffening frame, a directional heat spreader, a carrier, and a semiconductor chip. The stiffening frame is attached to the carrier. The stiffening frame includes a base portion with a central opening to accept a semiconductor chip and a first pair of opposing sidewalls. The semiconductor chip is electronically coupled to the carrier concentrically arranged within the central opening. A first directional heat spreader is thermally coupled to the semiconductor chip. The first directional heat spreader includes directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards the first pair of opposing sidewalls.
1. A method comprising:
attaching a stiffening frame to a carrier, the stiffening frame comprising a central opening to accept a semiconductor chip, a base portion, and a plurality of opposing sidewalls comprising a first pair of opposing sidewalls and a second pair of opposing sidewalls;
electronically coupling the semiconductor chip to the carrier concentrically arranged within the central opening;
thermally contacting a first directional heat spreader to the semiconductor chip, the first directional heat spreader comprising directionally thermally conductive material arranged to efficiently transfer heat from the semiconductor chip in a first opposing bivector direction towards the first pair of opposing sidewalls; and
thermally contacting a second directional heat spreader to the first directional heat spreader, the second directional heat spreader comprising directionally thermally conductive material arranged to efficiently transfer heat from the first directional heat spreader in a second opposing bivector direction towards the second pair of opposing sidewalls.
2. The method of claim 1 , wherein the first directional heat spreader contacts the first pair of opposing sidewalls.
3. The method of claim 1 , wherein the first directional heat spreader contacts a topside of the base portion.
4. The method of claim 1 , wherein a topside of the first directional heat spreader is coplanar with a topside of the second directional heat spreader.
5. The method of claim 1 , wherein the first opposing bivector direction and the second opposing bivector direction are orthogonal.
6. The method of claim 1 , wherein the second directional heat spreader contacts the second pair of opposing sidewalls.