IP Library Granted Patent US 9,545,033
Granted Patent B2
US 9,545,033 · App. 14/733,894 · Granted Jan 10, 2017

Communication module assembly with heat sink and methods of manufacture

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Quick Facts
Patent No.
US 9,545,033
App. No.
14/733,894
Granted
Jan 10, 2017
Kind
B2
Abstract

A communication assembly can include: a module device; a cage having a body defining a first open end that is configured to receive the module device therethrough and the body defining one or more first receiver members between the first end and a second end opposite of the first end, the one or more first receiver members having a first part of fastening system (e.g., two-part fastening system); and a heat sink adapted to be received into the cage so as to be thermally coupled with the module device, the heat sink having a body defining one or more second receiver members configured to receive the one or more first receiver members, the one or more second receiver members having a second part of the fastening system that couples with the first part of the fastening system.

Claims (15)

1. An assembly comprising:

a cage having a cage body defining a first open end and an open top, the cage body having one or more rails on each side of the open top between the first open end and a second end wall of the cage body, a cage cavity having the first open end and the open top;

a module device located in the cage cavity so as to protrude from the first open end; and

a heat sink slidably received and located in the cage cavity over and thermally coupled with the module device so as to protrude from the open top, the heat sink having a heat sink body defining one or more slots on each side that slidably receive and mate with the one or more rails of the cage,

wherein one of the rails or the slots includes one or more leaf springs and another of the rails or the slots includes one or more leaf spring-receiving surfaces.

2. An assembly comprising:

a cage having a cage body defining a first open end and an open top, the cage body having a rail on each side of the open top extending from a second end of the cage body toward the first open end, a cage cavity having the first open end and the open top;

a module device located in the cage cavity so as to protrude from the first open end; and

a heat sink slidably received into the second end and located in the cage cavity over and thermally coupled with the module device so as to protrude from the open top, the heat sink having a heat sink body defining slots on each side that slidably receive and mate with the rails of the cage,

wherein one of the rails or the slots includes one or more leaf springs and another of the rails or the slots includes one or more leaf spring-receiving surfaces.

3. An assembly comprising:

a cage having a cage body defining a first open end and an open top, the cage body having a plurality of rails on each side of the open top between the first open end and a second end wall of the cage body, a cage cavity having the first open end and the open top, the plurality of rails on each side of the open top have a rail gap between each of the rails;

a module device located in the cage cavity so as to protrude from the first open end; and

a heat sink slidably received and located in the cage cavity over and thermally coupled with the module device so as to protrude from the open top, the heat sink having a heat sink body defining a plurality of slots on each side that slidably receive and mate with the plurality of rails of the cage, the plurality of slots on each side of the heat sink body have a slot gap between each of the slots,

wherein one of the rails or the slots includes one or more leaf springs and another of the rails or the slots includes one or more leaf spring-receiving surfaces.

Assignments (5)
PATENT RELEASE AND REASSIGNMENT Recorded Jul 5, 2022
From: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
To: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
Reel/Frame 060574/0001 →
SECURITY INTEREST Recorded Jul 1, 2022
From: II-VI INCORPORATED; II-VI DELAWARE, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; PHOTOP TECHNOLOGIES, INC.; COHERENT, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 060562/0254 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 1, 2020
From: FINISAR CORPORATION
To: II-VI DELAWARE, INC.
Reel/Frame 052286/0001 →
NOTICE OF GRANT OF SECURITY INTEREST IN PATENTS Recorded Sep 25, 2019
From: II-VI INCORPORATED; MARLOW INDUSTRIES, INC.; EPIWORKS, INC.; LIGHTSMYTH TECHNOLOGIES, INC.; KAILIGHT PHOTONICS, INC.; COADNA PHOTONICS, INC.; OPTIUM CORPORATION; FINISAR CORPORATION; II-VI OPTICAL SYSTEMS, INC.; M CUBED TECHNOLOGIES, INC.; II-VI PHOTONICS (US), INC.; II-VI DELAWARE, INC.; II-VI OPTOELECTRONIC DEVICES, INC.; PHOTOP TECHNOLOGIES, INC.
To: BANK OF AMERICA, N.A., AS ADMINISTRATIVE AGENT
Reel/Frame 050484/0204 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 8, 2015
From: NGUYEN, LONG VAN
To: FINISAR CORPORATION
Reel/Frame 035805/0227 →