Exposure apparatus

1. An exposure apparatus comprising:

a wafer stage configured to mount a wafer thereon;

an irradiation optical system configured to apply exposure light to a reticle;

a projecting optical system configured to guide the exposure light onto the wafer stage; and

an exposure order setting device configured to set an exposure order of shots in the wafer, based on a back surface temperature of a silicon plate, wherein

the wafer stage includes

a wafer clamp configured to hold the wafer, and

a plate clamp configured to hold the silicon plate having a predetermined film formed on a silicon substrate, the plate clamp including a plurality of temperature sensors placed on an upper surface side thereof to measure a back surface temperature of the silicon plate,

the projecting optical system applies the exposure light to the silicon plate on the plate clamp upon exposure of the silicon plate, and applies the exposure light to the wafer on the wafer clamp upon exposure of the wafer,

the temperature sensors measure a transition of the back surface temperature after completion of exposure of an irradiation area to which the exposure light is applied, and

the exposure order setting device calculates a transition of an amount of deformation of the silicon plate corresponding to an elapsed time after exposure based on the transition of the back surface temperature, uses a movement speed upon an area to which the exposure light is applied stepping and moving between shots to generate a function indicating a relationship between a position of the temperature sensors for the irradiation area and the transition of the amount of deformation of the silicon plate, extracts shots where the amount of deformation is within an allowable range based on the function, and sets any of the extracted shots as a shot of a next exposure target.

2. The exposure apparatus according to claim 1 , wherein the exposure order setting device calculates the amount of deformation of the silicon plate based on the back surface temperature.

3. The exposure apparatus according to claim 1 , wherein the exposure order setting device calculates the amount of deformation of the silicon plate based on the back surface temperature using a thermal expansion coefficient of the silicon plate.

4. The exposure apparatus according to claim 1 , further comprising a transfer mechanism configured to transfer the silicon template, wherein the plate clamp holds the transferred silicon plate.

5. The exposure apparatus according to claim 1 , wherein the silicon plate is fixed and placed on the plate clamp.

6. The exposure apparatus according to claim 1 , wherein the silicon plate is fixed and placed on the plate clamp, and includes a plurality of types of areas including a different film structure.

7. The exposure apparatus according to claim 1 , wherein the wafer stage is cooled during exposure of the wafer and during exposure of the silicon plate.