IP Library Granted Patent US 9,391,098
Granted Patent B2
US 9,391,098 · App. 14/737,023 · Granted Jul 12, 2016

Method of manufacturing a display device

View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,391,098
App. No.
14/737,023
Granted
Jul 12, 2016
Kind
B2
Abstract

An object of the present invention is to improve yield when manufacturing a display device. A method of manufacturing a display device for displaying an image using a display element includes exposing a first surface of a glass substrate o an aqueous solution containing hydrogen fluoride, forming an organic resin film having a polar group above the first surface of the glass substrate, forming a layer including a display element for displaying an image above the organic resin film, and bonding an opposing substrate so as to cover the display element.

Claims (20)

1. A method of manufacturing a display device comprising:

exposing a first surface of a glass substrate to an aqueous solution containing hydrogen fluoride;

forming an organic resin film having a polar group on the first surface of the glass substrate, without forming another film between the organic resin film and the first surface;

forming a layer including a display element for displaying an image above the organic resin film; and

bonding an opposing substrate so as to cover the display element.

2. The method of manufacturing a display device according to claim 1 , wherein after the opposing substrate is bonded, light is irradiated on the organic resin film from the glass substrate side to decompose at least one part of the organic resin film at the boundary between the organic resin film and the glass substrate, and after the light is irradiated, the glass substrate is peeled from the organic resin film.

3. The method of manufacturing a display device according to claim 1 , wherein a heat treatment is performed when forming the layer including the display element, light is irradiated on the organic resin film from the glass substrate side after the heat treatment, and the glass substrate is peeled from the organic resin film after the opposing substrate is bonded.

4. The method of manufacturing a display device according to claim 1 , wherein the organic resin film includes a polyimide.

5. The method of manufacturing a display device according to claim 4 , wherein the heat treatment is performed at least 300° C. or more when forming the display element.

6. The method of manufacturing a display device according to claim 5 , wherein the display element includes a thin film transistor.

7. A method of manufacturing a display device comprising:

exposing a first surface of a glass substrate to an aqueous solution containing hydrogen fluoride;

forming an organic resin film having a polar group so that the entire first surface of the organic resin film contacts with the first surface of the glass substrate;

forming a layer including a display element for displaying an image above the organic resin film; and

bonding an opposing substrate so as to cover the display element.

8. The method of manufacturing a display device according to claim 7 , wherein after the opposing substrate is bonded, light is irradiated on the organic resin film from the glass substrate side to decompose at least one part of the organic resin film at the boundary between the organic resin film and the glass substrate, and after the light is irradiated, the glass substrate is peeled from the organic resin film.

9. The method of manufacturing a display device according to claim 7 , wherein a heat treatment is performed when forming the layer including the display element, light is irradiated on the organic resin film from the glass substrate side after the heat treatment, and the glass substrate is peeled from the organic resin film after the opposing substrate is bonded.

10. The method of manufacturing a display device according to claim 7 , wherein the organic resin film includes a polyimide.

11. The method of manufacturing a display device according to claim 10 , wherein the heat treatment is performed at least 300° C. or more when forming the display element.

12. The method of manufacturing a display device according to claim 11 , wherein the display element includes a thin film transistor.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 22, 2025
From: JAPAN DISPLAY INC.
To: MAGNOLIA WHITE CORPORATION
Reel/Frame 072130/0313 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 11, 2015
From: NAGANUMA, TOMOHIKO; KIMURA, YASUKAZU; NISHINOHARA, TAKUMA
To: JAPAN DISPLAY INC.
Reel/Frame 035824/0843 →